This application discloses a method, apparatus, device, and storage medium for determining the
critical load of a thin film. This application determines the total input
energy load curve through a thin film
scratch test. Based on the instantaneous
normal load and total input energy in the initial stage of the
scratch test, a baseline
energy load curve for the entire stage is determined. Then, the failure
energy load curve is determined using the
energy balance method. This application performs first-order differentiation on the failure energy load curve and finds the
peak value of the first-order derivative curve to determine the
critical load of the thin film. This method eliminates the subjectivity of manual observation and the
ambiguity of friction curves, greatly improving the
repeatability of the results. Furthermore, this method eliminates the need to calculate
cracking energy and peeling energy separately, avoiding the physical difficulties of directly calculating
cracking energy and peeling energy. The
peak value of the first-order derivative of the failure energy load curve more accurately corresponds to peeling in adhesion failure, thus the
critical load can be accurately determined based on the peeling point.