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Backflow preventing device and heat dissipating device with same

A technology of anti-backflow device and heat dissipation device, which is applied in the direction of cooling/ventilation/heating transformation, instruments, calculations, etc., can solve the problem of single anti-backflow solution for heat dissipation devices, and achieve the effect of anti-backflow solution

Active Publication Date: 2016-06-22
LENOVO (BEIJING) CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] Embodiments of the present invention provide an anti-backflow device and a heat sink with the anti-backflow device, which are used to solve the technical problem in the prior art that the anti-backflow solution of the heat sink is single, and realize the technology of diversifying the anti-backflow solution of the heat sink Effect

Method used

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  • Backflow preventing device and heat dissipating device with same
  • Backflow preventing device and heat dissipating device with same
  • Backflow preventing device and heat dissipating device with same

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0066] Please refer to figure 1 , is an anti-reflux device provided in Embodiment 1 of the present application, the device includes a baffle 1, and a connection structure 2 connected to the baffle 1, wherein the connection structure 2 is used to connect the baffle 1 to the heat dissipation Install the edge of the air outlet of fan 3 ( figure 1 The middle arrow a indicates that the airflow enters the fan from the air inlet, and the arrow b indicates that the airflow flows out of the fan from the air outlet of the fan), the connecting structure 2 and the baffle 1 are on the same horizontal plane, and the connecting structure 2 and the baffle 1 are both perpendicular to the fan 3 radial direction ( figure 1 The middle arrow c is the radial direction), that is, the spoiler 1 is in the state of not blocking the air outlet of the fan 3 .

[0067] In practical application, the above heat dissipation device is used to dissipate heat to electronic equipment or electronic components i...

Embodiment 2

[0100] Based on the same inventive concept as the first embodiment of the present application, the second embodiment of the present application provides a cooling device, please refer to Figure 7 ,include:

[0101] at least one fan, wherein each of the at least one fan has an air outlet;

[0102] An anti-backflow device arranged on the edge of the air outlet;

[0103] Wherein, the anti-backflow device includes:

[0104] spoiler;

[0105] A connection structure, used to connect the baffle to the edge of the air outlet of a fan in the heat dissipation device;

[0106] Wherein, when the fan is in a normal working state, the baffle is in an unobstructed state relative to the air outlet; when the fan is in an abnormal working state, the baffle is is blocked.

[0107]In practical application, the above heat dissipation device is used to dissipate heat to electronic equipment or electronic components in electronic equipment. At least one fan is arranged in the heat dissipation ...

Embodiment 3

[0121] Based on the same inventive concepts as the first and second embodiments of the present application, the third embodiment of the present application provides an electronic device, please refer to Figure 8 ,include:

[0122] The equipment body 6, and the heat dissipation device 7 arranged on the equipment body 6, the heat dissipation device 7 can dissipate heat to the components in the electronic equipment;

[0123] Wherein, the heat dissipation device 7 includes:

[0124] at least one fan, wherein each of the at least one fan has an air outlet;

[0125] An anti-backflow device arranged on the edge of the air outlet;

[0126] Wherein, the anti-backflow device includes:

[0127] spoiler;

[0128] A connection structure, used to connect the baffle to the edge of the air outlet of a fan in the heat dissipation device;

[0129] Wherein, when the fan is in a normal working state, the baffle is in an unobstructed state relative to the air outlet; when the fan is in an ab...

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PUM

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Abstract

The invention discloses a backflow preventing device and a heat dissipating device with the same. The backflow preventing device comprises a spoiler and a connecting structure used for connecting the spoiler to the edge of an air outlet of a fan in the heat dissipating device. When the fan is in a normal work state, the spoiler is in a non-sheltered state relative to the air outlet; when the fan is in an abnormal work state, the spoiler is in a sheltered state relative to the air outlet.

Description

technical field [0001] The invention relates to the technical field of electronic equipment structure, in particular to a backflow prevention device and a heat dissipation device with the backflow prevention device. Background technique [0002] The fan wall plays a very important role in the heat dissipation system of the server. For example, a fan wall composed of multiple fans is arranged in a rack server to dissipate heat from the electronic components in the server so as to protect the electronic components in the server. Existing In the technology, in order to prevent backflow when a single fan in the fan wall fails, a louver-type anti-backflow device is installed at the air outlet of the single fan in the fan wall. [0003] However, in the process of realizing the technical solution of the invention in the embodiment of the present application, the inventor of the present application found that the above-mentioned technology has at least the following technical proble...

Claims

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Application Information

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IPC IPC(8): G06F1/20H05K7/20
CPCH05K7/20145G06F1/20
Inventor 田婷贺潇曹世彧
Owner LENOVO (BEIJING) CO LTD