Backflow preventing device and heat dissipating device with same
A technology of anti-backflow device and heat dissipation device, which is applied in the direction of cooling/ventilation/heating transformation, instruments, calculations, etc., can solve the problem of single anti-backflow solution for heat dissipation devices, and achieve the effect of anti-backflow solution
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Embodiment 1
[0066] Please refer to figure 1 , is an anti-reflux device provided in Embodiment 1 of the present application, the device includes a baffle 1, and a connection structure 2 connected to the baffle 1, wherein the connection structure 2 is used to connect the baffle 1 to the heat dissipation Install the edge of the air outlet of fan 3 ( figure 1 The middle arrow a indicates that the airflow enters the fan from the air inlet, and the arrow b indicates that the airflow flows out of the fan from the air outlet of the fan), the connecting structure 2 and the baffle 1 are on the same horizontal plane, and the connecting structure 2 and the baffle 1 are both perpendicular to the fan 3 radial direction ( figure 1 The middle arrow c is the radial direction), that is, the spoiler 1 is in the state of not blocking the air outlet of the fan 3 .
[0067] In practical application, the above heat dissipation device is used to dissipate heat to electronic equipment or electronic components i...
Embodiment 2
[0100] Based on the same inventive concept as the first embodiment of the present application, the second embodiment of the present application provides a cooling device, please refer to Figure 7 ,include:
[0101] at least one fan, wherein each of the at least one fan has an air outlet;
[0102] An anti-backflow device arranged on the edge of the air outlet;
[0103] Wherein, the anti-backflow device includes:
[0104] spoiler;
[0105] A connection structure, used to connect the baffle to the edge of the air outlet of a fan in the heat dissipation device;
[0106] Wherein, when the fan is in a normal working state, the baffle is in an unobstructed state relative to the air outlet; when the fan is in an abnormal working state, the baffle is is blocked.
[0107]In practical application, the above heat dissipation device is used to dissipate heat to electronic equipment or electronic components in electronic equipment. At least one fan is arranged in the heat dissipation ...
Embodiment 3
[0121] Based on the same inventive concepts as the first and second embodiments of the present application, the third embodiment of the present application provides an electronic device, please refer to Figure 8 ,include:
[0122] The equipment body 6, and the heat dissipation device 7 arranged on the equipment body 6, the heat dissipation device 7 can dissipate heat to the components in the electronic equipment;
[0123] Wherein, the heat dissipation device 7 includes:
[0124] at least one fan, wherein each of the at least one fan has an air outlet;
[0125] An anti-backflow device arranged on the edge of the air outlet;
[0126] Wherein, the anti-backflow device includes:
[0127] spoiler;
[0128] A connection structure, used to connect the baffle to the edge of the air outlet of a fan in the heat dissipation device;
[0129] Wherein, when the fan is in a normal working state, the baffle is in an unobstructed state relative to the air outlet; when the fan is in an ab...
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