Brittle material plastic deformation-fracture transformation critical depth and critical load detecting method based on nanometer cut-in instrument

A technology of plastic deformation and critical depth, which is applied in the direction of analyzing materials, instruments, measuring devices, etc., can solve the problems of poor reliability and low detection accuracy, and achieve the effect of overcoming the indentation depth

Active Publication Date: 2016-07-06
ZHEJIANG UNIV OF TECH
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Problems solved by technology

[0004] In order to overcome the deficiencies of low detection accuracy and poor reliability of current brittle material plastic deformation-fracture transition critical depth and critical load detection technology, the present invention provides a method that combines the nano-intrusion fracture test with the press-in fracture theory, and the accuracy Higher and more reliable detection method for plastic deformation-fracture transition critical depth and critical load of brittle materials

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  • Brittle material plastic deformation-fracture transformation critical depth and critical load detecting method based on nanometer cut-in instrument
  • Brittle material plastic deformation-fracture transformation critical depth and critical load detecting method based on nanometer cut-in instrument
  • Brittle material plastic deformation-fracture transformation critical depth and critical load detecting method based on nanometer cut-in instrument

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example 1

[0060] Example 1: Detection of plastic deformation-fracture transition critical depth and critical load of sapphire C-face. According to the analysis of the shape of diamond abrasive grains used in ultra-precision machining, the angle range between the facet and the center line is 46° to 82°, and its average value is close to 65.3° of the Bosch indenter; the angle between the edge and the center line is 62° to 89° , its mean value is close to that of the Bosch indenter 77.05°, therefore, the indenter is selected from the Bosch indenter. The hardness of the C surface of sapphire is 29Gpa, and its hardness value is relatively large. The maximum load is set to 500mN, the incision rate is 1μm / s, and the incision distance is 50μm. The mechanical constants of sapphire are respectively: hardness H=29Gpa, elastic modulus E=430Gpa, Poisson’s ratio ν=0.25, Bosch indenter equivalent half-cone angle α=35.16°; into formula (4), the plastic deformation stage is obtained The relationship cu...

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Abstract

The invention discloses a brittle material plastic deformation-fracture transformation critical depth and critical load detecting method based on a nanometer cut-in instrument. The method comprises the steps that the radius of a brittle fracture area is obtained based on a nanometer cut-in fracture test, and a relation curve of the radius of a fracture area in the brittle fracture stage and the press-in depth is obtained in a fitting mode through a press-in fracture theory; the curve is intersected with a relation curve of the radius of a plastic area in the plastic deformation stage and the press-in depth, and the true plastic deformation-fracture transformation critical depth is obtained; the plastic deformation-fracture transformation critical load is obtained based on the relation among the load, depth and displacement recorded by the nanometer cut-in instrument in real time. The brittle material plastic deformation-fracture transformation critical depth and critical load detecting method combines the nanometer cut-in fracture test and the press-in fracture theory, and is high in precision and good in reliability.

Description

technical field [0001] The invention relates to the technical field of ultra-precision machining of brittle materials, in particular to a method for detecting the critical depth and critical load of plastic deformation-fracture transition of brittle materials based on a nano-scratch instrument. Background technique [0002] At present, brittle materials (such as engineering ceramics, optical glass, glass ceramics, optical crystals and single crystal semiconductors, etc.) have been widely used in important fields such as aerospace, precision optics, microelectronics communication and semiconductor devices. However, the surface and subsurface damage introduced by the machining process will not only reduce the strength of the material, but also reduce the optical damage threshold, which will seriously affect the performance of the material. In order to reduce the subsurface damage of mechanical processing, ductile domain processing is usually required. The depth of cut in the ...

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G01N3/58
CPCG01N3/58G01N2203/0067
Inventor 王华东张泰华蒋伟峰彭光健
Owner ZHEJIANG UNIV OF TECH
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