Brittle material plastic deformation-fracture transformation critical depth and critical load detecting method based on nanometer cut-in instrument

Abstract

The invention discloses a brittle material plastic deformation-fracture transformation critical depth and critical load detecting method based on a nanometer cut-in instrument. The method comprises the steps that the radius of a brittle fracture area is obtained based on a nanometer cut-in fracture test, and a relation curve of the radius of a fracture area in the brittle fracture stage and the press-in depth is obtained in a fitting mode through a press-in fracture theory; the curve is intersected with a relation curve of the radius of a plastic area in the plastic deformation stage and the press-in depth, and the true plastic deformation-fracture transformation critical depth is obtained; the plastic deformation-fracture transformation critical load is obtained based on the relation among the load, depth and displacement recorded by the nanometer cut-in instrument in real time. The brittle material plastic deformation-fracture transformation critical depth and critical load detecting method combines the nanometer cut-in fracture test and the press-in fracture theory, and is high in precision and good in reliability.

Description

technical field [0001] The invention relates to the technical field of ultra-precision machining of brittle materials, in particular to a method for detecting the critical depth and critical load of plastic deformation-fracture transition of brittle materials based on a nano-scratch instrument. Background technique [0002] At present, brittle materials (such as engineering ceramics, optical glass, glass ceramics, optical crystals and single crystal semiconductors, etc.) have been widely used in important fields such as aerospace, precision optics, microelectronics communication and semiconductor devices. However, the surface and subsurface damage introduced by the machining process will not only reduce the strength of the material, but also reduce the optical damage threshold, which will seriously affect the performance of the material. In order to reduce the subsurface damage of mechanical processing, ductile domain processing is usually required. The depth of cut in the ...

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Problems solved by technology

[0004] In order to overcome the deficiencies of low detection accuracy and poor reliability of current brittle material plastic deformation-fracture transition critical depth and critical load detection technology, the present invention provides a method that combines the nano-intrusion fracture test with the press-in fracture theory, and the accuracy Higher and more reliable detection method for plastic deformation-fracture transition critical depth and critical load of brittle materials

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