Reflective high thermal conductivity metal-based printed circuit board and its application

Abstract

The invention relates to a light-reflection and high-thermal conductivity metal matrix printed circuit board and application thereof. The circuit board is used for connecting and supporting various electronic devices and comprises a metal layer plate, a metal foil plate and an insulation layer, wherein the metal layer plate is arranged between the insulation layer and the metal foil plate so that the insulation layer and the metal foil plate are separated by the metal layer; and when the electronic device is connected to the metal foil plate, heat is dissipated directly through the metal layer.

Description

technical field [0001] The invention relates to a printed circuit board, in particular to a reflective high thermal conductivity metal base printed circuit board and its application, wherein the longitudinal and lateral thermal conductivity of a metal layer is utilized to effectively solve the problem of thermal energy generated by electronic devices during operation. Background technique [0002] With the development of science and technology and the progress of the times, various scientific and technological products have been created correspondingly. With the continuous development of high-power and miniaturized electronic devices, in electronic devices or related products, the thermal energy generated by electrical energy conversion or supply causes The problem of operation and operation of various electronic devices is also becoming more and more serious due to the heat generation caused by thermal energy. Therefore, the problem of heat dissipation of various products or...

AI Technical Summary

Problems solved by technology

Therefore, in metal-based printed circuit boards, the heat dissipation capacity of the metal part cannot be used effectively, so that the improvement of heat dissipation performance is very limited.

In addition, the insulating layer of metal-based printed circuit boards and ordinary printed circuit boards has low reflectivity to light. Even if ceramic-based PCBs are used, the reflectivity can only reach 85%-95%, which cannot reach mirror aluminum and mirror copper. The reflectivity of the substrate is more than 98%

[0006] Therefore, neither the traditional printed circuit board nor the metal-based printed circuit board can effectively solve the problem of heat dissipation, and at the same time, it cannot be used as a reflective layer with high reflectivity.

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