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RHU shell with thermal expansion matching performance

A technology of matching performance and thermal expansion, applied in the direction of cabinet/cabinet/drawer parts, etc., can solve problems such as damage and large stress, and achieve the effects of stable performance, release of thermal stress, and simple structure

Inactive Publication Date: 2016-07-20
CHINA ELECTRONIC TECH GRP CORP NO 18 RES INST
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] Due to the harsh environmental conditions on the moon, the temperature of the RHU shell and the fluid circuit evaporator may reach a high temperature of 265°C during lunar daytime, and the RHU shell and the fluid circuit evaporator use different materials (the RHU shell is made of 2A12 aluminum Alloy, the fluid circuit evaporator uses 316L stainless steel), under such a high temperature change, the different thermal expansion coefficients between the two will cause a lot of stress, and it is easy to cause technical problems such as damage

Method used

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Examples

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Embodiment 1

[0024] A RHU shell with thermal expansion matching performance is provided with a slit on the side of the RHU shell, and the RHU shell releases stress through the slit when heated and expanded; the width of the slit is greater than the deformation of the RHU shell at the highest temperature. There are three lugs at the position of the gap, which are fastened with screws, and a butterfly spring is added between the screws and the lugs, and the contraction of the gap is realized through the deformation of the butterfly spring.

[0025] The concrete structure and implementation process of this embodiment are as follows:

[0026] A RHU shell with thermal expansion matching performance. According to the lunar ambient temperature and the output power of the isotope nuclear source, the maximum temperature that the RHU shell may reach during the lunar day is calculated.

[0027] According to the nominal size of the RHU shell measured at normal temperature (20°C), the maximum temperatu...

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Abstract

The invention relates to a RHU shell with a thermal expansion matching performance and belongs to the technical field of isotope heat sources for space. The RHU shell with the thermal expansion matching performance is characterized in that a gap is arranged at the side face of the RHU shell with the thermal expansion matching performance, and the RHU shell releases stress through the gap when the RHU shell is heated to expand; a convex lug is arranged at the position of the gap and is fastened by a screw; a butterfly spring is added between the screw and the convex lug; and retraction of the gap is realized through deformation of the butterfly spring. The RHU shell with the thermal expansion matching performance has the advantages of simple structure, operation convenience, good safety and good reliability, steady performances, a capability of releasing thermal stress efficiently, good RHU shell thermal expansion matching performance and the like.

Description

technical field [0001] The invention belongs to the technical field of isotope heat sources for space, and in particular relates to a RHU shell with thermal expansion matching performance. Background technique [0002] At present, the exploration of the moon and Mars has very profound technical and social value. Lunar exploration projects need to achieve lunar landing, and the environmental conditions of the moon are relatively harsh. The ambient temperature can reach -170°C during moonlit nights. At this temperature, many devices cannot work normally, and heat sources are needed for insulation. [0003] Based on the above factors, the use of isotope heat source can effectively solve this problem. The radiation heat generated by its internal isotope nuclear source is used to provide heat to the equipment in the detector cabin through the two-phase fluid circuit to prevent the equipment from being damaged by freezing during the moon night. [0004] Due to the harsh environm...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K5/02
Inventor 阎勇侯旭峰
Owner CHINA ELECTRONIC TECH GRP CORP NO 18 RES INST
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