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Mask plate for depositing film layer, film layer and array substrate

A technology of array substrate and mask plate, which is applied in coating, metal material coating process, ion implantation plating, etc., can solve the problems of uneven film thickness, etc., to improve uniformity, expand sputtering range, and increase resistance the consistent effect of

Inactive Publication Date: 2016-07-27
BOE TECH GRP CO LTD +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0008] The embodiment of the present application provides a mask for depositing a film, a film, and an array substrate, which are used to expand the sputtering range during film formation by adding a second opening in the mask, thereby improving the The problem of uneven thickness of deposited film

Method used

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  • Mask plate for depositing film layer, film layer and array substrate
  • Mask plate for depositing film layer, film layer and array substrate
  • Mask plate for depositing film layer, film layer and array substrate

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Embodiment Construction

[0036] The embodiment of the present application provides a mask for depositing a film, a film, and an array substrate, which are used to expand the sputtering when forming a film through the mask by adding a second opening in the mask. range, thereby improving the problem of uneven thickness of the deposited film.

[0037] The following will clearly and completely describe the technical solutions in the application with reference to the drawings in the embodiments of the application. Apparently, the described embodiments are part of the embodiments of the application, not all of them. Based on the embodiments in this application, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the scope of protection of this application.

[0038] see figure 2 , the embodiment of the present application provides a mask plate for depositing a film layer, the mask plate includes a first opening 201 for sputtering, and the mask pl...

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Abstract

The invention provides a mask plate for depositing a film layer, the film layer and an array substrate. Second open holes are additionally formed in the mask plate, the sputtering range during film forming is enlarged, and therefore the problem that the thickness of the film layer obtained through deposition is not even is solved. The mask plate comprises first open holes used for sputtering and the second open holes partially overlapping with projections of the first open holes on the horizontal plane.

Description

technical field [0001] The present application relates to the field of display technology, and in particular to a mask for depositing a film, a film, and an array substrate. Background technique [0002] In order to continuously meet the needs of users, the size of the display panel is getting bigger and bigger. Correspondingly, the uniformity of film thickness has more and more obvious visual effects on the display panel. Whether a film layer with a similar thickness can be formed directly restricts the improvement of the overall quality of the display panel. [0003] At this stage, the uniformity of the film layer is mainly improved through the following two angles: [0004] First, adjust the power at the edge of the target to compensate for the unevenness caused by the sputtering process of the equipment; [0005] Second, by adopting the S-type walking mode and waiting, adjust the operation mode of the magnet on the cathode side (CA), so as to obtain a more uniform film...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C23C14/04C23C14/34
CPCC23C14/044C23C14/34
Inventor 宁智勇赵永亮毕鑫杨宇桐
Owner BOE TECH GRP CO LTD