Circuit stacking structure

Abstract

The invention discloses a circuit stacking structure, wherein the circuit stacking structure includes a wire layer, a supporting part and a protection layer. The wiring layer includes a plurality of metal wires arranged separately, and the supporting parts are respectively located in the gaps between any two adjacent metal wires, and are electrically insulated from the metal wires. The protection layer covers the wire layer and the supporting part, and through the support of the supporting part, the area corresponding to the supporting part on the top surface of the protective layer is flush with the area corresponding to each metal line.

Description

technical field [0001] The present invention relates to a circuit stacking structure, and in particular to a circuit stacking structure of an active element array substrate. Background technique [0002] figure 1 It is a partial top view of a known active device array substrate 10 . Such as figure 1 As shown, the active device array substrate 10 includes a glass substrate 20 , a driving chip 30 , a plurality of data lines 40 and a plurality of scan lines 50 . The data lines 40 , the scan lines 50 and the driving chip 30 are all disposed on the glass substrate 20 . The driver chip 30 is coupled to the data line 40 and the scan line 50 on the one hand, and connected to a flexible circuit board pad area 80 through a transition line area 60 on the glass substrate 20 on the other hand. The transition line area 60 is located between the driver chip 30 and the pad area 80 of the flexible circuit board, and the wiring in it continues from the pad area 80 of the flexible circuit ...

AI Technical Summary

Problems solved by technology

[0004] However, due to the differences in form between the raised portion 76 and the depressed portion 77 on the circuit stack structure 70 , such as differences in height or contact area, the protection layer 75 of the transition circuit region 60 is subjected to hard objects. When scratching, it is easy to cause the depression 77 to form a stress concentration point, or the bulge 76 bears excessive frictional force, so that the circuit of the wire layer 72 will not be effectively protected, and the risk of the wire layer 72 being damaged will be increased, thereby increasing the manufacturing process. or repair costs

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