A liquid metal printing device

Abstract

The invention discloses a liquid metal printing device. The equipment includes: a liquid metal printing mechanism; a substrate moving mechanism connected to the liquid metal printing mechanism; a voltage pulse regulation mechanism connected to the liquid metal printing mechanism and the substrate moving mechanism; a control device connected to the liquid metal printing mechanism and the substrate moving mechanism, And the voltage pulse control mechanism connection. The invention aims at the liquid metal ink with low viscosity and high surface tension, which not only improves the printing accuracy of the liquid metal pattern and the wettability between the liquid metal and the substrate, but also realizes plane printing and spatial 3D printing.

Description

technical field [0001] The invention relates to the field of manufacturing of printed circuits and printed electronic devices, in particular to a liquid metal printing device. Background technique [0002] A key factor restricting the development of printed electronic technology is the development of printed electronic materials. Traditional conductive inks include carbon-based conductive materials, conductive polymers and metal nanomaterials. Liquid metals have both metallic and fluid melting points. Low melting point alloys below 300°C can be configured as electronic inks. Compared with other conductive inks, liquid metal inks have low cost, stable physical and chemical properties, relatively high electrical conductivity, and the formation of conductive lines does not require post-processing. [0003] Different from the etching processing method adopted by traditional printed circuits, liquid metal ink can directly and quickly fabricate circuits by micro-channel method, ...

AI Technical Summary

Problems solved by technology

However, since liquid metal ink is a fluid with low viscosity and high surface tension, no matter what kind of existing methods there are certain problems in terms of printing accuracy, liquid metal and substrate wettability, etc.

For example, the microchannel method is not suitable for complex circuits, and due to the high surface tension, a large injection pressure needs to be applied when injecting liquid metal into the microchannel, which determines the limited precision of the circuit printed by the microchannel method; Like the microfluidic method, the film method needs to make a mold, which is time-consuming and laborious, and the produced pattern often has problems such as blurred edges and disconnected lines; the pattern produced by the imprinting method has limited precision and uneven line height; Slow, and there is also the problem of limited pattern accuracy; the existing liquid metal 3D printing method uses microsphere deposition method, the speed is very slow, and the pattern accuracy is very low; the direct writing method does not need to make a template, CN104118222A proposes a liquid metal The metal needle type printing equipment and printing method realize the quick printing of the circuit through the direct writing method, but because the surface tension of the printed liquid metal ink does not change much, the accuracy of the circuit is limited, and when the pinhole diameter is reduced, the liquid metal ink is easy to block the pen head , cannot print sub-micron size patterns, and the device is not suitable for printing 3D patterns

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