Bonding machine

A bonding machine, a technology to be bound, applied in the direction of conveyor objects, transportation and packaging, etc., can solve the problems of increasing production costs, reducing the market competitiveness of manufacturers, and being unable to bind and process multiple products, so as to improve the universal sexual effect

Active Publication Date: 2018-08-14
SHENZHEN LIANDE AUTOMATION EQUIP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The same type of conventional bonding machine can only bind specific materials to obtain corresponding products, but cannot bind multiple materials to obtain multiple products
When a manufacturer needs to process a variety of bonding products, it needs to purchase multiple bonding machines of different types for production, which not only increases the production cost, but also virtually reduces the market competitiveness of the manufacturer

Method used

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Embodiment Construction

[0020] In order to facilitate the understanding of the present invention, the present invention will be described more fully below with reference to the associated drawings. Preferred embodiments of the invention are shown in the accompanying drawings. However, the present invention can be embodied in many different forms and is not limited to the embodiments described herein. On the contrary, the purpose of providing these embodiments is to make the disclosure of the present invention more thorough and comprehensive.

[0021] It should be noted that when an element is referred to as being “fixed” to another element, it can be directly on the other element or there can also be an intervening element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or intervening elements may also be present. The terms "vertical," "horizontal," "left," "right," and similar expressions are used herein for purposes of ill...

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PUM

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Abstract

The invention relates to a bonding machine. The bonding machine comprises a bonding machine body, a first feeding mechanism used for conveying first to-be-bonded materials and second feeding mechanisms used for conveying second to-be-bonded materials. The first feeding mechanism is connected with the bonding machine body so as to convey the first to-be-bonded materials to the bonding machine body. The second feeding mechanisms are detachably connected with the bonding machine body, one of the multiple second feeding mechanisms can be selected to be connected with the bonding machine body, and therefore the different second to-be-bonded materials can be conveyed to the bonding machine body, and the bonding machine body can bond the first to-be-bonded materials and the second to-be-bonded materials. According to the bonding machine, only one second feeding mechanism needs to be selected from the multiple second feeding mechanisms to be connected with the bonding machine body, the different second to-be-bonded materials and the first to-be-bonded materials can be bonded through the bonding machine body, producing and machining of various products are achieved, and universality of the bonding machine is improved.

Description

technical field [0001] The invention relates to the technical field of automatic production equipment, in particular to a bonding machine. Background technique [0002] The bonding machine is an automatic equipment commonly used in the production and processing of chip coatings. The common bonding machines include glass substrate chip (COG, Chip On Glass) bonding machine, chip on film (COF, Chip On Film) bonding machine Wait. Conventional bonding machines of the same type can only bind specific materials to obtain corresponding products, but cannot bind multiple materials to obtain multiple products. When a manufacturer needs to process a variety of bonding products, it needs to purchase multiple bonding machines of different types for production, which not only increases the production cost, but also virtually reduces the market competitiveness of the manufacturer. Contents of the invention [0003] Based on this, it is necessary to provide a universal bonding machine. ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B65G47/90
CPCB65G47/90
Inventor 胡金曾强
Owner SHENZHEN LIANDE AUTOMATION EQUIP
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