PCB (Printed Circuit Board) and mobile terminal provided with same

Abstract

The invention discloses a PCB (Printed Circuit Board) and a mobile terminal provided with same. The PCB comprises multiple layers of conducting layers which are mutually stacked and a conductive through hole used for connecting two conducting layers which are far away from each other, wherein the conductive through hole comprises a plurality of sub-hole sections which are connected along a vertical direction in sequence; two adjacent sub-hole sections are connected through one conducting layer, and two adjacent sub-hole sections are staggered with each other. According to the PCB of the invention, through separate setting of the sub-hole sections of the conductive through hole, routing on each conducting layer can be flexibly avoided during drilling, and an electroplating filling process can be omitted during production of the PCB, so that the copper material is saved and the production efficiency is improved.

Description

technical field [0001] The invention relates to the technical field of mobile terminals, in particular to a PCB board and a mobile terminal with the PCB board. Background technique [0002] Vias are an important part of the PCB board, some of which are used to complete the connection of the signal lines of each layer, some are used to connect the power layer, some are used to connect the ground wire, and some are used for heat dissipation. In the related art, in order to realize the electrical connection between the conductive layers in the multi-layer PCB board, it is usually necessary to make stacked holes between multiple conductive layers, and to make stacked holes between multiple conductive layers requires electroplating and filling of the via holes , so that not only the cost of the via hole is high, but also the electroplating filling process cannot achieve a completely flat copper surface, and there will be a certain depression above the via hole, which is prone to ...

AI Technical Summary

Problems solved by technology

In the related art, in order to realize the electrical connection between the conductive layers in the multi-layer PCB board, it is usually necessary to make stacked holes between multiple conductive layers, and to make stacked holes between multiple conductive layers requires electroplating and filling of the via holes , so that not only the cost of the via hole is high, but also the electroplating filling process cannot achieve a completely flat copper surface, and there will be a certain depression above the via hole, which is prone to problems such as connection failure or voids.

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