Imprinting device

Abstract

An imprinting device (1) capable of realizing uniform transfer regardless of the thickness of a substrate includes a stage (40) having a placement area (41) for placing a substrate (71) to which a transferred object (70) is applied, a thin-plate mold (30) with flexibility having a fine pattern on a first surface (31) facing the placement area (41) of the stage (40), which is held with a predetermined tension and a pressing roll (10) which can press a second surface (32) opposite to the first surface (31) of the mold (30), in which the stage (40) has plural adsorption holes (43) around the placement area (41), and the adsorption holes (43) start adsorption in synchronization with movement of the pressing roll (10).

Description

technical field [0001] The present invention relates to an imprint apparatus for forming minute patterns. Background technique [0002] In recent years, in the optical elements used in products such as displays and lighting, it is desired to realize devices that have discovered new functions that have not been found before. The devices are formed by forming tiny patterns (on the order of nanometers (nm) to the order of micrometers (μm)) that exhibit special optical properties. ) to control the reflection and diffraction of light. As a method of forming a fine pattern as described above, in addition to photolithography and electron beam etching, imprint technology has attracted attention in recent years. The imprint technique refers to a technique of transferring a microscopic pattern of a mold by pressing a mold having a micropattern formed on its surface against a body to be transferred. [0003] Specific methods include thermal imprinting and UV imprinting. The thermal ...

AI Technical Summary

Problems solved by technology

[0012] However, in the imprint method described in Patent Document 1, there is a problem that when the end portion of the substrate 71 has a step difference, after the pressing roller 10 passes the end portion of the substrate 71, the mold 30 is lifted from the substrate 71, causing the substrate The transfer of minute patterns at the end of 71 deteriorates significantly

For example, if Figure 11 As shown, when the substrate 71 is thicker than the flat plate 40 provided around the substrate 71, the stress of the pressing roller 10 concentrates on the corners of the substrate 71, thereby causing the mold 30 to bend and possibly float from the substrate 71.

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