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Communication Method of 3D Optical Chip Network

A technology of an optical network on a chip and a communication method, which is applied in the field of communication of a network on a chip, can solve problems such as single node congestion, and achieve the effect of improving throughput and reducing delay

Active Publication Date: 2018-12-21
XIDIAN UNIV +1
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] The purpose of the present invention is to address the deficiencies of the above-mentioned prior art, and propose a communication method for a three-dimensional optical-on-chip network to remove deadlocks in communication, solve the problem of single node blocking affecting communication of other nodes, improve resource utilization, reduce Delay, improve network throughput

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  • Communication Method of 3D Optical Chip Network

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Embodiment Construction

[0037] Embodiments of the present invention will be further described in detail below in conjunction with the accompanying drawings.

[0038] The present invention takes three-dimensional Mesh and three-dimensional Torus structure as an example, solves the problem that the link utilization rate is low when the three-dimensional Mesh and three-dimensional Torus structure adopts optical circuit switching, and single node blocking affects the communication of other nodes, and solves the problem of using optical circuit in the three-dimensional Torus structure The exchange deadlock problem can effectively improve the utilization rate of network resources, thereby reducing communication delay and improving network throughput.

[0039] refer to figure 1 , the implementation steps of the present invention are as follows:

[0040] Step 1: Network initialization.

[0041] The initialization of the network includes three steps: parameter initialization, network construction and coordi...

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Abstract

The invention discloses a communication method for a three-dimensional optical on-chip network, which mainly solves the problems of low utilization rate of communication links, single node blocking affecting other node communications, large communication delay and low network throughput in the existing three-dimensional optical on-chip network. The technical solution is: taking the three-dimensional Mesh and Torus structure as an example, when a resource reservation group is blocked at an intermediate node, the resource reservation group is retransmitted according to the real-time network situation, and the resource reservation group is retransmitted during the resource reservation group retransmission process. The conditions for reserving packet retransmission are optimized. The present invention overcomes the problem that the communication blockage in the three-dimensional Mesh and three-dimensional Torus structure is relatively large, and the blockage of a single node affects the communication of other nodes. The lock improves the utilization rate and throughput of the communication link and reduces the delay with little increase in energy consumption, and can be used to realize efficient communication between IP cores on the optical chip.

Description

technical field [0001] The invention belongs to the technical field of communication, and in particular relates to a communication method of an on-chip network, which can be used to realize efficient communication between IP cores on an optical chip. Background technique [0002] In the process of system-on-chip developing towards multi-core and heterogeneity, the concept of network-on-chip was proposed. Its core idea is to integrate computer network technology into chip design and completely improve the bus structure from the system structure. series of questions. However, as the number of IP cores on a monolithic integrated circuit reaches many cores or even thousands of cores, and the size of integrated circuits enters the nanometer era, the clock frequency is getting higher and higher, and problems such as parasitic capacitance and signal crosstalk in electrical interconnection technology will become very significant. . Due to the advantages of high bandwidth, low powe...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H04L12/913H04L12/933H04L47/724
CPCH04L47/724H04L49/109
Inventor 顾华玺谭伟王琨杨银堂张博文曹蓉朱可馨
Owner XIDIAN UNIV