Chip mounter working head pre-pressing movement mechanism

Abstract

The invention relates to the technical field of Z-axis up-down movement in the chip mounter industry, and especially relates to a chip mounter working head pre-pressing movement mechanism. The chip mounter working head pre-pressing movement mechanism comprises first-stage gears. A pre-pressing mechanism base is provided with an upper slide block connection base and a lower slide block connection base; slide blocks on the upper and lower slide block connection bases are connected with a guide rail; a rotation shaft of a servo motor is fixedly connected with the first first-stage gear; a transmission gear shaft on a servo motor base plate is fixedly provided with the second first-stage gear and a second-stage gear from the left to the right in sequence; the first first-stage gear is engaged with the second-stage gear; the second first-stage gear is engaged by a tooth bar; one end of the tooth bar is fixedly connected with the upper slide block connection base; and a compensation tooth bar is arranged in a side groove in the left side wall of the tooth bar. The beneficial effects are that the chip mounter working head pre-pressing movement mechanism reduces generation of noise, and greatly improves up-down movement precision in the Z-axis direction, and the motion efficiency of Z axis in vertical direction is at least improved by four times. The chip mounter working head pre-pressing movement mechanism has the advantages of simple structure, reasonable arrangement and low manufacturing cost and the like.

Description

technical field [0001] The invention relates to the technical field of Z-axis up and down movement in the chip mounter industry, in particular to a preloading movement mechanism of a working head of a chip mounter. Background technique [0002] Surface mount technology SMT (Surface Mounted Technology), as a new generation of electronic assembly technology, has penetrated into various fields. SMT products have the advantages of compact structure, small size, vibration resistance, impact resistance, good high-frequency characteristics, and high production efficiency. SMT has occupied a leading position in the mounting process of circuit boards and LED lamp beads. [0003] However, the existing placement machines still have the following problems: 1. As the size of the assembled components becomes smaller, the assembly density is getting higher and higher, which requires the placement accuracy of the placement machine to be further improved. One of the important reasons for t...

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Problems solved by technology

[0003] However, the existing placement machines still have the following problems: 1. As the size of the assembled components becomes smaller, the assembly density is getting higher and higher, which requires the placement accuracy of the placement machine to be further improved. One of the important reasons for the accuracy is the up and down movement accuracy of the Z axis; 2. When the placement head is in the placement work, the placement head is first positioned by the X and Y axes, and then placed by driving the Z axis in the vertical direction. Usually, the Z-axis generally needs to travel 20mm in the vertical direction to complete the placement work; obviously, in the face of increasing labor costs, the product must have a competitive price in the market under the premise of ensuring quality, so it is necessary to shorten the time for the Z-axis to move up and down To improve the placement efficiency of the whole machine

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