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A kind of assembly and inspection method of ld laser component

An inspection method and laser technology, applied in the field of LD lasers, achieve the effect of simple method, strong operability, and improved coupling efficiency

Active Publication Date: 2018-04-17
HEFEI CHIP FOUND MICROELECTRONICS EQUIP CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The purpose of the present invention is to solve the defect that there is no LD laser coupling assembly method in the prior art, and provide an assembly and inspection method of LD laser components to solve the above problems

Method used

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  • A kind of assembly and inspection method of ld laser component
  • A kind of assembly and inspection method of ld laser component
  • A kind of assembly and inspection method of ld laser component

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Embodiment Construction

[0029] In order to have a further understanding and understanding of the structural features of the present invention and the achieved effects, the preferred embodiments and accompanying drawings are used for a detailed description, as follows:

[0030] Such as figure 2 As shown, the assembled LD laser assembly in the prior art includes a semiconductor light-emitting diode 1, the semiconductor light-emitting diode 1 is opposite to the aspheric lens 3 through the lens barrel 2, and the other end of the aspheric lens 3 passes through the diaphragm 4 The optical fiber sleeve 5 is installed, and the optical fiber ceramic plug 6 is also installed on the optical fiber sleeve 5, and the rear end of the optical fiber ceramic plug 6 is connected with an optical fiber. The light emitted by the semiconductor light-emitting diode 1 is coupled to the fiber optic ceramic plug 6 through the aspheric lens 3 , and then transmitted through the optical fiber at the rear end of the fiber optic c...

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Abstract

The invention relates to an assembling and inspecting method for an LD laser assembly. Compared with the prior art, the assembling and inspecting method solves the defect of lacking an LD laser coupling and assembling method. The assembling and inspecting method comprises the steps of: inspection of a semiconductor light-emitting diode; inspection of an aspherical coupling lens; insertion of an optical fiber ceramic plug; and inspection of the optical fiber ceramic plug and an optical fiber interface port. Through respectively testing the initial power of light, the power of light passing through the aspherical coupling lens and the power of light passing through an optical fiber, the alignment debugging of the optical fiber is realized by utilizing precise control of an optical fiber sleeve, a diaphragm is subjected to spot welding by means of a precision specialized welding wire so as to connect a lens barrel and the optical fiber sleeve, the actual coupling efficiency is greatly improved, the method is simple and feasible, and the operability is very high.

Description

technical field [0001] The invention relates to the technical field of LD lasers, in particular to an assembly and inspection method of LD laser components. Background technique [0002] Due to its excellent performance, LD laser has always been the first choice for the light source of laser direct writing laser lithography machine. The LD laser is composed of multiple LDs, which are combined into a high-power light source through optical fibers. The difficulty in assembling the LD laser lies in how to successfully couple the LDs to the optical fibers. A good operating method directly affects the optical coupling efficiency, which directly determines the total output power. How to develop a reliable coupling assembly method has become an urgent technical problem to be solved. Contents of the invention [0003] The object of the present invention is to solve the defect that there is no LD laser coupling assembly method in the prior art, and provide an LD laser component a...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G02B6/42H01S5/02
CPCG02B6/4225G02B6/4296H01S5/02
Inventor 夏焱
Owner HEFEI CHIP FOUND MICROELECTRONICS EQUIP CO LTD