Treatment module of a plant for horizontal wet chemical treatment of large substrates, treatment method and use thereof
A processing module and chemical processing technology, which is applied in the direction of liquid chemical plating, coating, metal material coating process, etc., can solve the problem of unable to meet the processing of large substrates
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[0020] As used herein, the term "wet chemical" processing according to the present invention refers to an electroless processing that does not utilize electrical current to achieve metal deposition on a substrate. This wet chemical treatment can be carried out by immersing the substrate in a process liquid, where a process liquid level is provided within the process module which remains above the upper surface of the substrate during the process; or by spraying the process liquid The wet chemical treatment is performed on at least one surface of the substrate.
[0021] As used herein, the term "metal" when applied to the apparatus for horizontal wet chemical processing of substrates according to the present invention refers to metals known to be suitable for this horizontal deposition method. These metals include gold, nickel, tin and copper, preferably copper.
[0022] As used herein, the term "large substrate" when applied to a processing module according to the invention r...
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