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Treatment module of a plant for horizontal wet chemical treatment of large substrates, treatment method and use thereof

A processing module and chemical processing technology, which is applied in the direction of liquid chemical plating, coating, metal material coating process, etc., can solve the problem of unable to meet the processing of large substrates

Active Publication Date: 2019-01-01
ATOTECH DEUT GMBH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

Said horizontal equipment, which has previously been successfully used for the production of printed circuit boards, cannot meet these new requirements for handling large substrates, in particular glass substrates such as flat panel displays

Method used

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  • Treatment module of a plant for horizontal wet chemical treatment of large substrates, treatment method and use thereof
  • Treatment module of a plant for horizontal wet chemical treatment of large substrates, treatment method and use thereof
  • Treatment module of a plant for horizontal wet chemical treatment of large substrates, treatment method and use thereof

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Embodiment Construction

[0020] As used herein, the term "wet chemical" processing according to the present invention refers to an electroless processing that does not utilize electrical current to achieve metal deposition on a substrate. This wet chemical treatment can be carried out by immersing the substrate in a process liquid, where a process liquid level is provided within the process module which remains above the upper surface of the substrate during the process; or by spraying the process liquid The wet chemical treatment is performed on at least one surface of the substrate.

[0021] As used herein, the term "metal" when applied to the apparatus for horizontal wet chemical processing of substrates according to the present invention refers to metals known to be suitable for this horizontal deposition method. These metals include gold, nickel, tin and copper, preferably copper.

[0022] As used herein, the term "large substrate" when applied to a processing module according to the invention r...

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Abstract

The present invention is related to a treating module of an apparatus for horizontal wet-chemical treatment of large-scale substrates, in particular glass substrates, comprising a housing with a housing cover; a transport device comprising a plurality of transport elements for horizontal processing of large-scale substrates, wherein the treating module further comprises at least a first liquid nozzle and at least a gas nozzle arranged above the transport level of the large-scale substrates at the entry and at the exit of the treating module for accumulating treatment liquid inside of the treating module, wherein the gas nozzle is arranged more exterior than the respective first liquid nozzle; at least a liquid weir arranged below each first liquid nozzle below the transport level of the large-scale substrates; and at least an adjusting device for adjusting the transport device and the liquid weirs of the treating module. The present invention is further directed to a method for treating of large-scale substrates in a horizontal apparatus comprising among others such a treating module.

Description

technical field [0001] The invention relates to a treatment module of a plant for the horizontal wet chemical treatment of large substrates, in particular glass substrates, comprising: a housing with a housing cover; a transport device comprising multiple a transfer element, wherein the processing module further comprises at least a first liquid nozzle and at least a gas nozzle arranged above the transfer height of the large substrate at the inlet of the processing module, and at least a first liquid nozzle arranged above the transfer height of the large substrate at the outlet of the processing module , at least one further first liquid nozzle and at least one further gas nozzle for accumulating processing liquid within the processing module, wherein each gas nozzle is arranged further outward than the corresponding first liquid nozzle; Below the transport level is arranged below the respective first liquid nozzle. [0002] The invention further relates to a method for proce...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/67
CPCH01L21/6776C03C17/002C23C18/1608C23C18/1632C23C18/165C23C18/1889C23C18/38H01L21/67051H01L21/6708
Inventor 罗兰德·哈恩克里斯蒂安·托马斯马丁·诺斯纳托马斯·奥特奥拉夫·洛伦佐
Owner ATOTECH DEUT GMBH