Water-cooling upper polishing disc structure of polishing machine

Abstract

The invention discloses a water-cooling upper polishing disc structure of a polishing machine. The water-cooling upper polishing disc structure comprises an upper disc working disc. An upper disc water cooling disc is arranged at one end side of the upper disc working disc. Cavities are formed between the upper disc water cooling disc and the upper disc working disc. The upper disc water cooling disc is provided with water inlets and water outlets, wherein each water inlet and the corresponding water outlet communicate with the corresponding cavity. The water-cooling structure is constituted by the multiple cavities which are independent of one another; each cavity is provided with the corresponding independent water inlet and the corresponding independent water outlet; a water way of the water-cooling upper polishing disc structure is of a reciprocating labyrinth type; cooling water is effectively prevented from taking a shortcut; it is guaranteed that the cooling water cannot flow out through the water outlets until the cavities are filled with the cooling water; it is helpful to fully cool the upper disc working disc through the cooling water; heat generated due to processing is taken away in time, and thus the effect of conducting forced cooling on a polishing disc is achieved; and compared with traditional passive type cooling, more reliability is achieved.

Description

technical field [0001] The invention relates to the technical field of polishing machines, in particular to a water-cooled upper polishing disc structure of the polishing machine. Background technique [0002] The upper polishing disc of the polishing machine used for thin and brittle materials such as silicon wafers will generate a lot of heat during the polishing process, and the temperature change will inevitably cause the deformation of the polishing disc, which will affect the processing quality. Therefore, the temperature of the polishing disc must be strictly controlled. . In recent years, the size of silicon wafers for IC processing tends to be larger in diameter, and the quality requirements for the morphology of silicon wafers are becoming more and more stringent. For polishing equipment used for double-sided polishing of silicon wafers, the deformation of the polishing disc must be strictly controlled. The water cooling structure of the upper polishing disc is ma...

AI Technical Summary

Problems solved by technology

[0003] Previously, the polishing disc of the double-sided polishing machine used an integral structure without a special temperature control device. The heat generated during the polishing process was mainly taken away by the polishing liquid, which was passive cooling, and the temperature change of the polishing disc was uncontrollable.

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