A method for preparing a three-dimensional microelectrode array using photoresist

Abstract

The invention discloses a method for preparing a three-dimensional microelectrode array by using photoresist. The method comprises the following steps: forming a first photoresist layer on a silicon substrate; forming a first insulating layer on the first photoresist layer; forming a plurality of holes which are distributed in an arrayed manner, penetrate through the first insulating layer and the first photoresist layer and reach to the upper surface of the silicon substrate, wherein the holes are filled with metal to form a metal body; forming a metal lead of which one end is connected with the upper surface of the metal body; connecting the other end of the metal lead to a bonding pad; forming a second insulating layer on the first insulating layer; covering the upper surface of the metal body and the metal lead by using the second insulating layer; removing the silicon substrate so that the lower surface of the metal body is exposed; removing the first photoresist layer, and enabling the lower part of the metal body to be exposed to form a three-dimensional micro-electrode array. Dry etching is carried out on the photoresist to form a three-dimensional structure. Compared with the prior art, the process is simplified, and the manufacturing cost is also greatly reduced.

Description

technical field [0001] The invention relates to the field of biomedical engineering, in particular to a method for preparing a three-dimensional microelectrode array by using photoresist. Background technique [0002] The Vision Artificial Retina System can help restore some vision to patients blinded by retinal diseases such as age-related macular degeneration (AMD) and retinitis pigmentitis (RP). The nerve electrical stimulation microelectrode array implanted inside the eyeball and attached to the retina is the key technology in the artificial retina system. Therefore, it is necessary to produce a microelectrode array with excellent performance, effective adhesion to the retina, and good biocompatibility. Microelectrode arrays prepared by MEMS (Micro Electromechanical System) technology can be well used in artificial retina systems. The electrode area of ​​the three-dimensional microelectrode array protrudes from the electrode plane, and has a larger actual surface area, ...

AI Technical Summary

Problems solved by technology

This technology also needs to prepare a three-dimensional hole structure on the silicon substrate by means of dry and wet etching processes, which is complex and costly.

[0005] It can be seen that most of the existing methods for preparing three-dimensional microelectrode arrays are to form the required three-dimensional structure on the silicon substrate through a combination of wet and dry etching, which will lead to complex processes and increase the cost of manufacturing.

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