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Method for automatically recognizing maximum modal component

A technology of automatic identification and maximum mode, applied in special data processing applications, instruments, electrical and digital data processing, etc., can solve the problems of large waste of human resources, low efficiency, occupation of computing resources, etc., to reduce labor intensity and improve efficiency. , the effect of reducing occupancy

Active Publication Date: 2016-10-26
10TH RES INST OF CETC
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Problems solved by technology

[0007] The purpose of the present invention is to propose an automatic determination of the maximum mode that can save human resources, have higher efficiency, and occupy less computing resources in view of the shortcomings of existing technical solutions, such as large waste of human resources, low efficiency, and large occupation of computing resources. Component methods

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  • Method for automatically recognizing maximum modal component
  • Method for automatically recognizing maximum modal component
  • Method for automatically recognizing maximum modal component

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Embodiment Construction

[0019] refer to Figure 1-Figure 4 . The present invention can be realized with reference to the following examples. According to the invention, the invention requires the determination of the maximum modal displacement node. The maximum modal displacement node represents the location of the greatest deformation in the mode shape. The process of determining the maximum mode displacement node in the present invention includes: defining a matrix of Rn×2.

[0020] In the process of finite element modal analysis of modular electronic equipment, a flat and componentized analysis model is established, and the division standard is selected according to the requirements of structural modularization and functional independence to divide the analysis model into multiple parallel and independent components , to determine the maximum modal displacement node and its component. First, define a matrix of Rn×2, in which column 1 stores the numbers of all nodes in the model, and column 2 st...

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Abstract

The present invention provides a method for automatically recognizing a maximum modal component. By adoption of the method, occupation of human resources and computing resources can be largely reduced, and efficiency can be increased by times. According to the technical scheme, the method comprises establishing a flattening and componentized analysis model during a modularized electronic device finite element modal analysis process, dividing the analysis module into a plurality of mutually parallel and independent components, and determining the maximum modal displacement node and the component to which the maximum modal displacement node belongs. The method specifically comprises defining an Rn*2 matrix, and determining the vector having the maximum absolute value and the row where the vector is located by using a comparison method; comparing the maximum modal displacement node number with the node number of a node set included by the component one by one, and determining the maximum modal displacement node; judging whether the modal node is located in a node set included by some component in the model to determine the component to which the maximum modal displacement node belongs; and if the node set included by some component includes the maximum modal displacement node, determining the component being the maximum modal component, and therefore directly determining the maximum modal component.

Description

technical field [0001] The invention relates to a method for automatically determining the maximum mode component, in particular, it is suitable for automatically identifying the maximum mode component in the interpretation process of the finite element mode results of modularized electronic equipment. Background technique [0002] With the rapid development of the information industry, the printed circuit board (PCB) has become an indispensable part of the structure of electronic equipment. Printed circuit board (PCB) plays a vital role in modern electronic devices, and its reliability has a great influence on electronic devices. With the development of the electronics industry, the application range of printed circuit board assemblies (PCBA) is becoming wider and wider, and it is inevitable to be used in various harsh environments. At the same time, harsh environments have a great impact on packages, especially Vibration and shock According to statistics, the vibration fa...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G06F17/50
CPCG06F30/367
Inventor 任建峰
Owner 10TH RES INST OF CETC
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