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Coating process for preventing coating from cracking

A coating process and coating technology, used in coatings, devices for coating liquids on surfaces, and surface pretreatment, etc., can solve the problems of easy cracking, inability to industrialize, and exposure of coatings, and achieve enhanced mechanical strength and Insulation performance, coating cracking prevention, simple process effect

Inactive Publication Date: 2016-11-09
惠州联顺电子有限公司
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0002] In the existing electronic components, the same material is coated once or twice on the surface and then directly cured to form a coating, or two or more materials are mixed evenly and then coated, and then directly cured to form a coating. This kind of coating and curing process is single, and the formed coating is easy to crack when subjected to vibration, exposing the inner matrix of the product, and the coating loses its insulation and protection effect on the inner matrix.
There are also new materials with stable performance on the market for coating electronic components. However, the research and development costs are high and the research and development cycle is long.

Method used

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  • Coating process for preventing coating from cracking
  • Coating process for preventing coating from cracking

Examples

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Embodiment 1

[0025] Please refer to figure 1 and figure 2 , figure 1 It is the coating process flow chart of the present embodiment to prevent cracking of the coating, figure 2 is a schematic cross-sectional view of the coated product of this embodiment. As shown in the figure, step S1 is performed to prepare a substrate 1 and three coating materials. In this embodiment, the substrate is a varistor, and the three coating materials include a first coating material, a second coating material and a third coating material, and the three are powdered epoxy resins of different compositions. Next, step S2 is executed, and the powdery first coating material is coated on the surface of the substrate 1 by a coating machine. Execute step S3, place the semi-finished product after step S2 in an oven, set the temperature of the oven to 150° C., and bake for 120 minutes, so that the first coating material is cured on the surface of the substrate 1 to form the first coating 2 . Continue to execute ...

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Abstract

The invention discloses a coating process for preventing a coating from cracking. A plurality of different materials are selected, and the surface of an electronic part is coated with the materials; solidification is conducted on the materials layer by layer correspondingly; and a firm protective layer is formed on the surface of the electronic part so that the electronic part can adapt to various harsh use environments, the coating is not prone to cracking, and the service life of the product is prolonged accordingly. The coating process for preventing the coating from cracking is easy to operate, low in cost and suitable for industrial production.

Description

technical field [0001] The application belongs to the field of component surface coating technology, and in particular relates to a coating technology for preventing coating cracking. Background technique [0002] In the existing electronic components, the same material is coated once or twice on the surface and then directly cured to form a coating, or two or more materials are mixed evenly and then coated, and then directly cured to form a coating. This kind of coating and curing process is simple, and the formed coating is easy to crack when subjected to vibration, exposing the inner matrix of the product, and the coating loses its function of insulating and protecting the inner matrix. There are also new materials with stable performance on the market for coating electronic components. However, the research and development costs are high, the research and development cycle is long, and the cost of the new materials researched is relatively high, which is not suitable for...

Claims

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Application Information

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IPC IPC(8): B05D7/00B05D3/02
CPCB05D7/544B05D3/0254B05D7/584B05D2518/00B05D2518/10B05D2420/01B05D2420/02
Inventor 马惠民王华彬张峰
Owner 惠州联顺电子有限公司
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