A shielding device, its shielding method, and an evaporation system
A technology of evaporation and evaporation source, which is applied in the field of shielding device and evaporation system, can solve the problems of poor repeatability, high cost associated with time, and high cost of materials, so as to improve stability and yield, realize continuity control, The effect of saving vapor deposition materials
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Embodiment 1
[0033] This embodiment provides a shielding device, such as figure 1 As shown, it includes a power mechanism 1 and a shielding mechanism 2. The power mechanism 1 is used to drive the shielding mechanism 2 to change different positions. The evaporation channel between the plating source 3 and the evaporation rate sensor 5 is opened; it is also used to open the evaporation channel between the evaporation source 3 and the substrate 4 to be plated, and keep the evaporation source 3 and the evaporation rate sensor The evaporation channels between 5 are opened.
[0034] By setting the shielding mechanism 2, the shielding device can shield the vapor deposition channel between the vapor deposition source 3 and the substrate to be coated 4 in the vapor deposition rate control stage, and maintain the distance between the vapor deposition source 3 and the vapor deposition rate sensor 5. The evaporation channel between them can be opened; the evaporation channel between the evaporation s...
Embodiment 2
[0045] This embodiment provides a shielding device, which is different from Embodiment 1, such as Figure 5 As shown, the blocking mechanism 2 is in the shape of a cylinder, and one end of the cylinder is used to face the evaporation surface of the evaporation source 3. The diameter of the cylinder extends away from the power mechanism 1, and the diameter of the cylinder is greater than or equal to the evaporation surface of the evaporation source 3. The diameter of the plating source 3; the blocking mechanism 2 can rotate clockwise and counterclockwise within the range of 0-90° included angle between the tube diameter and the axis 31 of the evaporation source 3.
[0046] In this embodiment, in the vapor deposition rate control stage, when the cylindrical shielding mechanism 2 rotates to the shielding position, it just can completely shield the vapor deposition channel between the vapor deposition source 3 and the substrate to be coated 4, so as to avoid In the plating rate co...
Embodiment 3
[0052] This embodiment provides an evaporation system, including the shielding device in any one of Embodiments 1-2.
[0053] Wherein, the evaporation system also includes an evaporation source, an evaporation rate sensor and an evaporation film thickness controller, and the evaporation source is used for evaporating a film layer on the substrate to be coated. The evaporation rate sensor is used to collect the evaporation rate of the evaporation source, and send the collected evaporation rate to the evaporation film thickness controller. The evaporation film thickness controller is used to control the thickness of the film layer evaporated onto the substrate to be coated according to the evaporation rate. The control module of the shielding device is connected to the evaporation film thickness controller, and the evaporation film thickness controller is also used to control the control module to send a control command to the power mechanism.
[0054] By adopting the shielding...
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