The invention discloses a silicon wafer chemical and mechanical polishing composition with high stability, belonging to the technical field of polishing compositions for roughlly polishing a semiconductor silicon substrate material. The polishing composition comprises the following components in percentage by weight: 0.5-50 percent of silicon dioxide abrasive particles, 0.01-10 percent of silicon-containing stabilizer, 0.01-20 percent of organic alkali corrosive, 0.01 -10 percent of organic acid chelating agent, 0.01-5.0 percent of other functional auxiliaries and the balance of deionized water. The polishing solution has a stabilization period of over 2 years, can perform repeated polishing or cyclic polishing, and has stable pH value and removal speed, wherein the number of cyclic polishing times can be up to 10. Meanwhile, the polishing composition has high silicon wafer removal rate up to over 1.0 mum/min, and the cyclic polishing removal rate in multiple times can be stable. The polishing solution is convenient to prepare and easy to use, has low cost, and is suitable for the rough polishing of silicon wafers of various types and sizes in the semiconductor industry.