A heat dissipation integrated circuit packaging structure

Abstract

The invention discloses an integrated circuit package structure with an efficient heat radiation function. A metal heat radiation plate is fixed on an insulating support plate of the structure, a plurality of hollow square heat radiation frame bodies are formed on the outer edge of the metal heat radiation plate, a rectangular bearing seat is fixed at the middle part of the metal heat radiation plate, a rectangular placement hole is formed in the center of the bearing seat, an integrated circuit chip is connected and fixed in the placement hole of the bearing seat in an inserted manner and abuts against the metal heat radiation plate; grooves are formed in heat radiation frame bodies on two opposite sides of the metal heat radiation plate, extending plates are formed on the side edges of the bearing seat respectively, one group of extending plates opposite to the bearing seat are inserted in the grooves of the heat radiation frame bodies and side plates are formed on the group of extending plates opposite to the bearing seat, the side plates are fixed on the insulating support plate and abut against the outer walls of the heat radiation frame bodies on the outer layer of the metal heat radiation plate, and the other group of extending plates opposite to the bearing seat are connected into the heat radiation frame bodies on the inner layer of the metal heat radiation plate in the inserted manner. According to the integrated circuit package structure with the efficient heat radiation function, a structure that combines the metal heat radiation plate of a special shape with the integrated circuit package is adopted, so that efficient heat radiation can be realized in integrated circuit operation.

Description

Technical field: [0001] The present invention relates to the technical field of integrated circuits, and more specifically to a heat dissipation integrated circuit packaging structure. Background technique: [0002] The electronics industry continues to shrink the size of electronic components, and continue to increase functions in electronic components, which makes the function and complexity of integrated circuits continue to increase. This trend has also driven the packaging technology of integrated circuit components to develop in the direction of small size, high pin count, and high electrical / thermal efficiency, and meet predetermined industry standards. Since high-efficiency integrated circuit components generate higher heat, and the current small packaging technology only provides designers with a small heat dissipation mechanism, it is necessary to design a heat dissipation structure on the small packaging structure to achieve efficient heat dissipation and extend the us...

AI Technical Summary

Problems solved by technology

Since high-performance integrated circuit components generate higher heat, and the current small package technology only provides designers with a small heat dissipation mechanism, it is necessary to design a heat dissipation structure on its small package structure to achieve efficient heat dissipation and prolong the use of integrated circuits life

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