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Apparatus and method for treating substrate

A technology for processing substrates and substrates, which is applied in the directions of cleaning methods using liquids, chemical instruments and methods, cleaning methods and utensils, etc., and can solve problems such as prolonged chemical dispersion time.

Active Publication Date: 2016-12-07
SEMES CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] Generally, when a chemical is supplied onto a substrate to process a substrate during a process like a cleaning process, if the chemical is directly supplied onto a substrate having a thin film, due to a gap between the chemical and the substrate, Static electricity generated by the friction of the substrate, resulting in prolonged time for distributing the chemical across the substrate surface

Method used

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  • Apparatus and method for treating substrate
  • Apparatus and method for treating substrate

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Embodiment Construction

[0018] Hereinafter, embodiments of the present inventive concept will be described with reference to the accompanying drawings. The embodiments of the inventive concept may be modified in various forms and the scope of the inventive concept is not construed as being limited to the following embodiments. These embodiments will be provided to help those skilled in the art understand the inventive concept as completely as possible. The shapes or patterns of the drawings are exaggerated to more clearly show the structural configuration of elements in the drawings.

[0019] Embodiments of the inventive concept will be described with respect to a substrate processing apparatus for cleaning a substrate. However, the inventive concept may not be limiting but may be applied to various types of devices for distributing chemicals to a substrate.

[0020] will be combined in the following figure 1 and figure 2 Embodiments of the inventive concept are described in detail.

[0021] f...

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Abstract

An apparatus for treating a substrate includes an injecting member having a first nozzle configured to supply a first chemical to the substrate that is mounted on the supporting unit, and a second nozzle configured to supply a second chemical, which is different from the first chemical, to the substrate that is mounted on the supporting unit, and a controller configured to supply the first chemical before supplying the second chemicals and to control the first chemical, which is variable according to a type of thin film on the substrate mounted on the supporting unit, to be supplied.

Description

technical field [0001] Embodiments of the inventive concepts described herein relate to an apparatus and method for processing a substrate. Background technique [0002] Contaminants such as particles, organic pollutants, and metal pollutants left on the substrate surface deteriorate the characteristics and product yield of semiconductor devices. For this reason, a cleaning process for removing various types of contaminants attached to a substrate surface is very important in semiconductor fabrication. [0003] This process of cleaning the substrate is performed before and after each unit step of semiconductor manufacturing. Generally, cleaning a substrate includes: a chemical treatment process for removing foreign metal substrates, organic substances or particles left on the substrate, a rinsing process for removing chemicals left on the substrate with deionized water, and A drying process for drying substrates using organic solvents, supercritical fluids, or nitrogen. ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/67H01L21/02
CPCH01L21/02057H01L21/67023B08B2203/0229H01L21/67051H01L21/6875C11D2111/22H01L21/02052
Inventor 金大民李瑟李福圭李载明
Owner SEMES CO LTD