Unlock instant, AI-driven research and patent intelligence for your innovation.

Array substrate, fabrication method thereof and display device

A technology of array substrates and substrate substrates, which is applied in semiconductor/solid-state device manufacturing, electrical components, electric solid-state devices, etc., and can solve problems such as poor flatness effect

Active Publication Date: 2016-12-07
BOE TECH GRP CO LTD
View PDF6 Cites 11 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] In order to solve the problem of poor effect of improving flatness in the prior art, the present invention provides an array substrate, a manufacturing method thereof, and a display device

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Array substrate, fabrication method thereof and display device
  • Array substrate, fabrication method thereof and display device
  • Array substrate, fabrication method thereof and display device

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0049] In order to make the object, technical solution and advantages of the present invention clearer, the implementation manner of the present invention will be further described in detail below in conjunction with the accompanying drawings.

[0050] An embodiment of the present invention provides a method for manufacturing an array substrate, such as figure 2 As shown, the method includes:

[0051] Step 201 , sequentially forming a gate line, an active layer pattern, and a source-drain metal pattern on a base substrate, where the gate line and the source-drain metal pattern have overlapping regions.

[0052] Step 202 , forming a first planar layer on the substrate on which the source-drain metal pattern is formed and outside the overlapping region.

[0053] To sum up, the method for manufacturing the array substrate provided by the embodiment of the present invention can be used on the base substrate on which the source-drain metal pattern is formed, and at the overlap be...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention discloses an array substrate, a fabrication method and a display device, and belongs to the technical field of display. The method comprises the following steps of sequentially forming a gate line, an active layer pattern and a source-drain metal pattern on a substrate, wherein an overlapped region exists between the gate line and the source-drain metal pattern; and forming a first flat layer on a region on the substrate formed with the source-drain metal pattern and outside the overlapped region. By the method, the problem of relatively poor effect for improving flatness by the prior art is solved, the effect for improving the flatness is achieved, and the method is used for improving the flatness of the array substrate.

Description

technical field [0001] The present invention relates to the field of display technology, in particular to an array substrate, a manufacturing method thereof, and a display device. Background technique [0002] The solution process is one of the important processes for manufacturing a display device. The solution process refers to finely spraying the luminescent material in a solution state on a target position through an inkjet nozzle. However, the solution process has higher requirements on the flatness of the array substrate, and since there is an overlapping area between the gate lines and the source-drain metal pattern on the array substrate, the maximum height of the array substrate formed with the gate line and the source-drain metal pattern Far greater than the minimum height of the array substrate, so the flatness of the array substrate is poor. Therefore, a method for manufacturing an array substrate is needed to improve the flatness problem. [0003] There is a m...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
IPC IPC(8): H01L21/77H01L27/12
CPCH01L21/77H01L27/1214H01L27/1259
Inventor 陈江博顾鹏飞李伟王国英
Owner BOE TECH GRP CO LTD