Package structure and preparation method and application thereof
A technology of encapsulation structure and encapsulation glass, which is applied in semiconductor/solid-state device manufacturing, semiconductor devices, electrical components, etc., and can solve problems such as uneven edges of display devices
Active Publication Date: 2016-12-07
KUNSHAN GO VISIONOX OPTO ELECTRONICS CO LTD
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Problems solved by technology
[0004] Based on this, it is necessary to provide a packaging structure that can improve the uniformity of the packaging edge of the display device for the problem that the traditional packaging structure causes the unevenness of the edge of the display device.
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[0033] In order to make the above objects, features and advantages of the present invention more comprehensible, specific implementations of the present invention will be described in detail below in conjunction with the accompanying drawings. In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present invention. However, the present invention can be implemented in many other ways different from those described here, and those skilled in the art can make similar improvements without departing from the connotation of the present invention, so the present invention is not limited by the specific embodiments disclosed below.
[0034] The present invention proposes a package structure, which is arranged outside the packaged device, and includes a substrate, a cover plate, an encapsulation glass frit between the substrate and the cover plate, and a heat conduction strip arranged on the encapsulation glass frit. W...
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The invention relates to a package structure and a preparation method and application thereof. The package structure is arranged outside a packaged device. The package structure comprises a substrate, a cover plate, a package glass material and heat conducting strips, wherein the cover plate is arranged opposite to the substrate; the package glass material is positioned between the substrate and the cover plate; and the heat conducting strips are arranged on the package glass material, and the extending directions of the heat conducting strips are the same as the extending direction of the package glass material. In the package structure, due to the fact that the heat conducting strips with the extending directions which are the same as the extending direction of the package glass material are arranged on the package glass material, most of energy for laser scattering and package glass material molten state heat radiation can be guided to conduct along the extending directions of the heat conducting strips, so that the most of energy for laser scattering and package glass material molten state heat radiation is conducted into the package glass material, the heat conducted along the width direction of the package glass material is reduced, the influence on an organic film at the position a package edge close to the area of the package glass material is reduced, and the uniformity of the package edge of a display device is improved.
Description
technical field [0001] The invention relates to the field of display technology, in particular to a packaging structure, a preparation method thereof, and an application thereof. Background technique [0002] Display devices are more sensitive to the external environment, especially the light-emitting materials in organic electroluminescent devices are very sensitive to water vapor, oxygen and other pollutants. Therefore, in order to effectively isolate the intrusion of water, oxygen and other pollutants, the display device needs to be packaged. Generally, an encapsulant is used to bond the substrate provided with the light-emitting element and the cover plate together in the corresponding encapsulation area. [0003] See figure 1 , the traditional packaging structure uses glass frit (frit) sealing technology, however, in order to make the frit110' instantly welded to the substrate, during the laser sealing process of the frit110', when the frit's welding point is reached, ...
Claims
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IPC IPC(8): H01L51/52
Inventor 杜杨
Owner KUNSHAN GO VISIONOX OPTO ELECTRONICS CO LTD