Positioning reference point and method for improving cutting precision of circuit board

A technology of positioning datum and positioning method, applied in the directions of printed circuit, printed circuit manufacturing, printed circuit components, etc., can solve the problems of affecting cutting accuracy and inaccurate positioning coordinates.

Active Publication Date: 2016-12-07
NINGBO SUNNY OPOTECH CO LTD
View PDF5 Cites 12 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] An object of the present invention is to provide a positioning reference point and method for improving the cutting accuracy of circuit boards. By setting reference points on the PCB as positioning reference points, it

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Positioning reference point and method for improving cutting precision of circuit board
  • Positioning reference point and method for improving cutting precision of circuit board
  • Positioning reference point and method for improving cutting precision of circuit board

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0036] The following description serves to disclose the present invention to enable those skilled in the art to carry out the present invention. The preferred embodiments described below are only examples, and those skilled in the art can devise other obvious variations. The basic principles of the present invention defined in the following description can be applied to other embodiments, variations, improvements, equivalents and other technical solutions without departing from the spirit and scope of the present invention.

[0037] like figure 1 As shown, a printed circuit board or a printed circuit board (Printed Circuit Board, referred to as PCB) 10 has a tooling positioning piece 11 at each of the four corners, which can be a positioning column or a positioning hole, and is used for printing circuits and other operations. Positioning, wherein the tooling positioning part is set on a PCB substrate 12, preferably at the four corners, and the PCB substrate can be printed cir...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

No PUM Login to view more

Abstract

The invention discloses a positioning reference point and method for improving cutting precision of a circuit board. The positioning reference points are arranged on a printed circuit board (PCB), the positioning reference points are hollow points and are made by use of the same process as cutting positions of the PCB, each hollow point is completed through primary punching and is arranged at a technical edge of the PCB as a cutting reference point, and thus the laser cutting precision is improved.

Description

technical field [0001] The invention relates to the electronics industry that has high requirements for PCB segmentation manufacturing, especially relates to the positioning reference point and method for improving the cutting accuracy of the circuit board in the mobile phone camera PCB segmentation manufacturing industry, and solves the problem of PCB segmentation by designing positioning coordinates with high accuracy. Inaccurate positioning coordinates caused by PCB deformation, shrinkage, etc. affect the cutting accuracy. Background technique [0002] With the gradual development of electronic products in the direction of thin, small, light and micro, "dimensions" have become one of the important selling points of terminal products. A series of new challenges. [0003] At present, the SMT process technology used as the front-end manufacturing of the mobile phone camera module has strict requirements on the PCB segmentation size, but the PCB deformation, expansion and co...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
IPC IPC(8): H05K1/02H05K3/00
Inventor 赵丹丹易峰亮李海陈小康舒文良褚斌杰刘海滨
Owner NINGBO SUNNY OPOTECH CO LTD
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products