Cavity type flexible circuit board structure and manufacturing method thereof
A flexible circuit board, flexible technology, applied in the direction of flexible printed circuit boards, printed circuits, printed circuits, etc., can solve the problems of increasing the production links of electronic products, increasing costs, etc., to reduce production links, save costs, and have a simple structure. Effect
Active Publication Date: 2016-12-14
SHENZHEN XUNJIEXING TECH CORP LTD
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- Abstract
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- Application Information
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Problems solved by technology
[0005] The present invention provides a cavity-type flexible circuit board structure and its manufacturing method to solve the problem in the prior art that special key switches need to be arranged on the flexible circuit board, which not only increases the cost, but also increases the production links of electronic products
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[0014] The embodiments of the present invention will be described in detail below with reference to the accompanying drawings, but the present invention can be implemented in many different ways defined and covered by the claims.
[0015] Please refer to figure 1 , the invention provides a cavity-type flexible circuit board structure, which is especially suitable for pressing switches or buttons of some electronic products.
[0016] The cavity-type flexible circuit board structure includes a first flexible substrate layer 1, a first flexible copper layer 2, an adhesive layer 3, a second flexible copper layer 4 and a second flexible substrate layer 5 arranged in sequence from top to bottom. , wherein, a through hole 6 is opened on the adhesive layer 3, the first flexible copper layer 2 area located on the upper side of the through hole 6 forms the first switch contact, and the second flexible copper layer 4 area located on the lower side of the through hole 6 A second switch c...
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Abstract
The invention provides a cavity type flexible circuit board structure and a manufacturing method thereof. The circuit board structure comprises a first flexible base material layer, a first flexible copper layer, a bonding layer, a second flexible copper layer and a second flexible base material layer which are arranged orderly from top to bottom; a through hole is formed in the bonding layer; a first switch contact is formed in the region of the first flexible copper layer, and the region of the first flexible copper layer is located at the upper side of the through hole; and a second switch contact matching with the first switch contact is formed in the region of the second flexible copper layer, and the region of the second flexible copper layer is located at the lower side of the through hole. According to the cavity type flexible circuit board structure, a switch element is realized by utilizing a cavity in a flexible circuit board, and the switch element replaces a key or a switch arranged on the flexible circuit board in the prior art. Therefore, the cost of an electronic product is saved, the production link of the electronic product is reduced and installation of a metal dome connected between the printed board and the key is omitted; and the cavity type flexible circuit board structure has the advantages of being simple in structure and low in cost.
Description
technical field [0001] The invention relates to the field of circuit board manufacturing, in particular to a cavity-type flexible circuit board structure and a manufacturing method thereof. Background technique [0002] Flexible printed circuit board (Flexible Printed Circuit Board, abbreviated as FPC) is also called flexible printed circuit board, or flexible printed circuit board. [0003] With the development of smart electronic products, FPC products have been used by more and more electronic products, because it has many advantages that rigid printed circuit boards do not have. The product is small in size and light in weight, which greatly reduces the volume of the device, and is suitable for the development of electronic products in the direction of high density, miniaturization, light weight, thinning, and high reliability. It has high flexibility, can be freely bent, wound, and twisted , foldable, three-dimensional wiring, arbitrarily arranged and changed in shape ...
Claims
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Patent Timeline
Login to View More IPC IPC(8): H05K1/16
CPCH05K1/16H05K2201/05H05K2201/10053
Inventor 马卓陈强李星李飞雄朱远联刘洋洋
Owner SHENZHEN XUNJIEXING TECH CORP LTD