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Inner layer windowing multilayer flexible circuit board cover removing method

A technology of opening windows and inner layers, applied in multilayer circuit manufacturing, electrical components, printed circuit manufacturing, etc., can solve the problems of protective cover burrs, abnormal circuit tearing, uneven thickness of protective cover, uncontrollable laser depth, etc. Achieve the effect of reducing risk, good cutting depth and controlling scrap

Inactive Publication Date: 2016-12-14
台山市精诚达电路有限公司
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AI Technical Summary

Problems solved by technology

[0004] The first one is to manually peel off the protective cover after cutting the edge material area of ​​the protective cover by laser. Its advantage is that there is no risk of damage to the inner circuit. For the outer circuit in the multi-layer area outside the cover, a large number of burrs on the protective cover, abnormal tearing of the circuit, and low efficiency are caused by improper human operation.
[0005] The second method is to manually remove the protective cover after all the protective cover is cut by laser. This method can effectively overcome the shortcomings of the first method, but when using this method, the laser depth is caused by the uneven thickness of the protective cover and the combination of multiple layers. Uncontrollable, there is a risk of damaging the inner circuit

Method used

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  • Inner layer windowing multilayer flexible circuit board cover removing method
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  • Inner layer windowing multilayer flexible circuit board cover removing method

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Embodiment Construction

[0019] In order to describe the technical content, structural features, achieved goals and effects of the present invention in detail, the following will be described in detail in conjunction with the embodiments and accompanying drawings.

[0020] The most critical design of the present invention is: technology of the present invention, reserve a circle of copper-free grooves on the outer layer copper skin facing the window of the inner layer, and cut the outer layer FCCL along the copper-free grooves using laser cutting lines, the present invention It can effectively prevent damage to the inner circuit of FPC.

[0021] see figure 1 , the method for uncapping the multi-layer soft board with inner layer window opening of the present invention comprises the following steps:

[0022] S1. Perform copper electroplating on the multi-layer soft board with the inner window open, and set up a circle of copper-free grooves on the periphery of the protective cover facing the inner wind...

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Abstract

The present invention discloses an inner layer windowing multilayer flexible circuit board cover removing method. The method comprises the following steps of S1 carrying out the electro-coppering processing on an inner layer windowing multilayer flexible circuit board, and arranging a circle of copper-free groove at the periphery of a protection cover exactly facing an inner layer windowing; S2 utilizing a laser cutting line to cut the protection cover along the copper-free groove; S3 jittering to enable the protection cover to fall off. According to the present invention, the cutting depth can be controlled better at the laser cutting, the depth controllability of the laser cutting is guaranteed greatly, and the risk that the laser cutting damages an inner-layer FPC is reduced, at the same time, the stress of the protection cover after the protection cover is cut by the laser cutting is guaranteed, the protection cover falls off naturally at jitter, the quality problems, such as the rim charge residual of the protection cover, a torn outer-layer circuit, etc., do not occur.

Description

technical field [0001] The invention relates to the technical field of circuit boards, in particular to a method for opening a cover of a multi-layer soft board with an inner layer opening a window. Background technique [0002] FPC is also called flexible circuit board (flexible PCB), referred to as "soft board", also known as "flexible circuit board", also known as "flexible circuit board, flexible circuit board" or "flexible circuit board, flexible circuit board" , English is "FPC" or "FPCB". [0003] For products with windowed pads in the inner layer of multi-layer FPC, the protective cover at the windowed area is the outer layer FCCL (flexible board base material), and the outer layer FCCL is used to protect it to prevent the potion from affecting the pads at the inner windowed area. The erosion of the outer layer of the circuit is done after the protective cover is removed. There are two general methods for removing the protective cover. [0004] The first one is to ...

Claims

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Application Information

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IPC IPC(8): H05K3/00H05K3/46
CPCH05K3/0044H05K3/46H05K2203/0228H05K2203/107
Inventor 刘振华韩秀川
Owner 台山市精诚达电路有限公司
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