Totally-enclosed case heat radiation device

Abstract

The invention provides a totally-enclosed case heat radiation device comprising semiconductor refrigeration sheets, heat radiation fins, a first coil pipe clamp plate, a second coil pipe clamp plate and a coil pipe. The heat radiation surface of the semiconductor refrigeration sheets is fixed on the side plate of a peripheral totally-enclosed case and also connected with the heat radiation fins. The heat radiation fins are fixed on the external side surface of the side plate of the case. The first coil pipe clamp plate and the second coil pipe clamp plate are oppositely arranged. The opposite surfaces of the first coil pipe clamp plate and the second coil pipe clamp plate are provided with grooves adaptive to the shape of the coil pipe in a pairing way. The first coil pipe clamp plate and the second coil pipe clamp plate clamp the coil pipe. The first coil pipe clamp plate is fixed on the internal side surface of the side plate of the case and connected with refrigeration surface of the semiconductor refrigeration sheets. Heat radiation of the totally-enclosed case is performed through the semiconductor refrigeration sheets and the coil pipe connected with the semiconductor refrigeration sheets without influencing the sealing performance of the case.

Description

technical field [0001] The invention relates to the technical field of chassis heat dissipation, in particular to a heat dissipation device for a fully enclosed chassis. Background technique [0002] There are a lot of electronic components installed in the chassis. When working, these electronic components themselves will generate heat. However, for the chassis with high sealing requirements, especially the occasions requiring IP64 or above, the chassis needs to have a dust-proof function that completely prevents dust from intruding. , and has a waterproof function to prevent the intrusion of splashing water. At present, there are not many heat dissipation measures in the fully sealed chassis, which leads to an excessively high temperature inside the chassis, which will affect the performance of electronic components. [0003] The Chinese utility model patent with the publication number CN201138461Y discloses a heat pipe cooling device for a fully sealed chassis, including...

AI Technical Summary

Problems solved by technology

Although the heat inside the chassis is transferred to the outside of the chassis through the heat pipes arranged inside and outside the chassis, the heat pipes connect the interior of the chassis with the outside of the chassis, and cannot completely seal the chassis, and the protection level of the chassis cannot reach IP6

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