Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

High current usb Type C socket

A high-current, socket technology, applied in circuits, electrical components, coupling devices, etc., can solve the problems of short circuit of metal mid-plate and difficult high current passing, and achieve the effect of reducing impedance and enhancing current passing.

Active Publication Date: 2018-12-14
SHENZHEN EVERWIN PRECISION TECH
View PDF8 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The upper and lower two groups of conductive terminals respectively include a pair of ground terminals located on the outermost side and a pair of power terminals located in the middle. At present, in the case of realizing fast charging, the ground terminals and power terminals are required to allow a large current to pass through, but adding Thickening the power terminals will easily lead to a short circuit with the metal middle plate, while widening the power terminals is limited by the small spacing between terminals, making it difficult to effectively realize the passage of large currents

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • High current usb Type C socket
  • High current usb Type C socket
  • High current usb Type C socket

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0039] The following will combine Figure 1-Figure 15 The technical solution and technical principle of Embodiment 1 of the present application are introduced in detail.

[0040] see Figure 1 to Figure 4 As shown, the high-current USB Type C socket of the present application includes a metal middle plate 40, a first terminal group 50 located on the upper and lower sides of the metal middle plate 40, a second terminal group 70, and the first terminal group 50 and the second terminal group 70. The metal middle plate 40 is formed on the integral first insulator 60, and the second insulator 80 formed on the second terminal group 70 (such as Figure 12 shown), the third insulator 90 formed by forming the first insulator 60 and the second insulator 80 as a whole, the grounding member 30 sleeved on the third insulator 90, and the third insulator 90 surrounding the third The metal shell 10 outside the insulator 90 and the fourth insulator 20 integrally formed at the rear end of the...

Embodiment 2

[0063] see Figure 16 , Figure 17Compared with the first embodiment, the second embodiment of the present application shown is different from the second embodiment in that: the strip-shaped hole 42 on the metal middle plate 40 is penetrated in the insertion direction, so that the metal middle plate The 40-fold division is divided into a completely independent middle body part 41b and two side body parts 41a. At this time, the front ends of the first and second power terminals 50b, 70b do not need to be provided with groove structures, and there is no risk that the first and second power terminals 50b, 70b are too close to the metal middle plate 40 .

[0064] But at this time, what needs to be changed is that during the stamping process of the metal middle plate 40, the middle body part 41b and the two side body parts 41a are separately connected to the front strip of the metal middle plate 40 48 can solve the problem of strip connection caused by the separation of the midd...

Embodiment 3

[0066] see Figure 18 to Figure 20 Compared with the first embodiment, the third embodiment of the present application shown is different from the third embodiment in that: the front connecting portion 44 of the strip hole 42 of the metal middle plate 40 is cut off, and only the rear connecting portion 43 is reserved. And the rear end connecting portion 43 does not need to be thinned to form a concave portion.

[0067] The first power terminal 50b is bent upwards at the rear connecting portion 43 and then extends in parallel. The first power terminal 50b is located in front of the rear connecting portion 43 to form an upward fold A bent portion 57 and a parallel extending portion 58 extending from the upward bent portion 57 . The upwardly bent portion 57 and the parallel extending portion 58 are located on the holding portion 52 . Thus, the distance between the parallel extending portion 58 and the rear connecting portion 43 will be increased, and the upper part of the holdi...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

A high-current USB Type C socket, comprising a metal middle plate provided with a main body, a symmetrical first terminal group and a second terminal group respectively located on the upper and lower sides of the metal middle plate, and the first and second terminal groups Two terminal groups and the metal middle plate are integrally formed into an insulating body, the first and second terminal groups respectively include two first ground terminals and two second ground terminals located on the outermost sides, and two ground terminals located at the two Several first signal terminals and two first power supply terminals between the first ground terminals, and several second signal terminals and two second power supply terminals located between the two second ground terminals, the first , the thickness of the second power terminal is greater than the thickness of the first and second signal terminals, and the main body of the metal middle plate is provided with strip-shaped holes at positions corresponding to the first and second power terminals; the present application The high-current USB Type C socket can effectively support high-current charging.

Description

technical field [0001] The present application relates to an input and output electrical connector, especially a high-current USB Type C socket. Background technique [0002] The USB3.1 Type C interface is a new interface standard launched by the USB-IF Association in 2014. This standard takes into account both size and performance, and is suitable for applications on smart terminals, but it is not backward compatible. It generally includes a metal middle plate, two sets of conductive terminals arranged on the upper and lower sides of the metal middle plate, and an insulating material that holds the metal middle plate and the conductive terminals as a whole. The metal middle plate is used to shield the high-frequency interference of the upper and lower two sets of conductive terminals, limited by the size, the distance between the two sets of conductive terminals and the metal middle plate is very small, and the terminal thickness is 0.12mm Next, the distance between the te...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Patents(China)
IPC IPC(8): H01R13/02H01R13/6585
CPCH01R13/02H01R13/502H01R13/504H01R13/6461H01R13/648H01R13/6585
Inventor 张秀华李亚勇
Owner SHENZHEN EVERWIN PRECISION TECH
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com