102results about How to "No short circuit problem" patented technology

This display device (10) is comprised of a light guide plate (1) and a light source (6) provided on an end surface (1a) side of the light guide plate (1). A display unit (3) provided with a dot-like reflecting unit (2) with a reflective surface (2a) for reflecting light projected from the light source (6) to a surface (1b) side is formed on the light guide plate (1). The display unit (3) is set for the reflecting light from the dot-like reflecting unit (2) to be visually recognizable. The display device (10) is good at transparency and readily visually recognized, and can be easily manufactured at a low cost.

The invention relates to a high-current Type C socket, which comprises a metal medium plate, a first terminal group, a second terminal group and an insulating body, wherein the metal medium plate is provided with a main body portion, the first terminal group and the second terminal group are respectively located at the upper side and the lower side of the metal medium plate in a symmetrical manner, and the first terminal group, the second terminal group and the metal medium plate are molded into an integral whole by the insulating body. The first terminal group and the second terminal group respectively comprise two first grounding terminals, two second grounding terminals, a plurality of first signal terminals, two first power supply terminals, a plurality of second signal terminals and two second power supply terminals, wherein the two first grounding terminals and the two second grounding terminals are located at the outmost side, the plurality of first signal terminals and the two first power supply terminals are located between the two first grounding terminals, the plurality of second signal terminals and the two second power supply terminals are located between the two second grounding terminals, the thickness of the first power supply terminals and the second power supply terminals is greater than the thickness of the first signal terminals and the second signal terminals, and the main body portion of the metal medium plate is provided with strip-shaped holes at the positions corresponding to the first power supply terminals and the second power supply terminals. The high-current USB Type C socket can effectively support high-current charging.

The invention provides a TFT (Thin Film Transistor) array substrate manufacture method which comprises the following steps: coating and forming a flat layer on source electrodes and drain electrodes; instead of processing via holes, depositing and patterning a common electrode layer and a passivated protection layer; forming via holes in the passivated protection layer so as to expose the flat layer, and then ashing the flat layer so as to expose the drain electrodes. Compared with a conventional method by which the common electrode layer is deposited and patterned after the via holes are formed in the flat layer, the TFT array substrate manufacture method described in the invention is advantageous in that no electrically conductive material will be left in the via holes of the flat layer when the common electrode layer is patterned, and therefore no short circuit problem will occur in the via holes of the flat layer; the via holes are formed in the flat layer in a pixel region by a means of dry etching through ashing operation, the formed via holes are allowed to have large slope angles, and therefore the size of a TFT can be reduced to a certain extent and and pixel density can be improved.

Provided is a large-current USB Type C type socket, which comprises a metal middle plate provided with a main body portion; a first terminal group and a second terminal group, which are symmetrically arranged at the upper and lower sides of the metal middle plate; and an insulation body for enabling the first and second terminal groups to be integrated with the metal middle plate. The first terminal group comprises two outermost first grounding terminals, a plurality of first signal terminals, which are arranged between the two first grounding terminals, and two first power terminals; and a second terminal group comprises two outermost second grounding terminals, a plurality of second signal terminals, which are arranged between the two second grounding terminals, and two second power terminals. The thickness of the first power terminal and the thickness of the second power terminal are larger than the thickness of the first signal terminal and the thickness of the second signal terminal respectively; the main body portion of the metal middle plate is provided with strip holes in the positions corresponding to the first power terminals and the second power terminals respectively. The large-current USB Type C type socket can effectively support large-current charging.

Disclosed is a method for connecting microcircuits formed in a circuit board, such as a Tape Carrier Package (TCP), a Flexible Printed Circuit (FPC), a Liquid Crystal Display (LCD) or a printed circuit board using an anisotropic conductive adhesive including conductive particles, and the connection structure manufactured by the above method. The method comprises the steps of applying an insulating film layer to a circuit board having circuit patterns, and then boding them with an anisotropic conduction adhesive. The circuits that should not be connected by conductive particles included in the anisotropic conductive adhesive are prevented from a short-circuit

The invention discloses a three-phase separator which is provided with a tank (1), a cyclone separator (3), a transformer (9), a distributor (19), a plate electrode (6) and the like. The inner cavity of the tank is divided into a gas-liquid separation chamber (21) and an oil-water separation chamber (22) through a separator plate (18). A gas returning pipe (5) is arranged between the top of the cyclone separator and the top of the gas-liquid separation chamber. A spiral plate (31) is arranged on the inner wall of the cylindrical shell of the cyclone separator. The distributor is arranged at the lower part of the oil-water separation chamber, and a liquid conveying pipe (15) is arranged between the lower part of the gas-liquid separation chamber and the distributor. The plate electrode is a single-layer horizontal plate electrode, is arranged on the upper part of the oil-water separation chamber and is composed of a steel wire rope with an insulating layer and several insulating support plates and constant-pitch rods. The three-phase separator provided by the invention is mainly used for three-phase separation of oil, gas and water phases of crude oil produced from oilfields and oil wells.

The invention discloses an organic light emitting diode panel and device which is simple in preparation method and low in cost, and a preparation, short-circuit detection and short-circuit reparation method of the organic light emitting diode panel. The OLED panel comprises two or more light emitting units and one or more third electrodes, wherein each third electrode comprises an edge comprising a first edge extending out of the bottom side of the third electrode, and second electrodes of the adjacent light emitting units are positioned on the same layer and are disconnected at the edges of the third electrodes. Due to the fact that the light emitting units in the organic light emitting diode panel are connected in series, uniformity of integral brightness is ensured. The preparation method is simple and feasible. An ordinary open mask is adopted during preparation of the second electrodes, yield during technological process is ensured, cost is low, good operability is achieved, production cost is reduced, and production efficiency is increased.

The invention relates to a microresistor assembly comprising a resistor body, a first protective layer, a heat conducting layer, a second protective layer and two electrode layers, wherein the resistor body is provided with a first end part, a second end part and a center part, wherein the first end part and the second end part are opposite, and the center part is positioned between the first endpart and the second end part; the resistor body defines a center line; the first protective layer is arranged on a part of the center part of the resistor body and exposes the first end part and the second end part; the heat conducting layer is formed on a part of the resistor body in a depositing way; the second protective layer are arranged on a part of the heat conducting layer; and the two electrode layers respectively wrap the first end part and the second end part of the resistor body and are electrically connected with the heat conducting layer.

The static random access memory formed on the silicon-on-insulator substrate of the present invention adopts an SOI substrate, and the drains of the first pull-up transistor (PU-1) and the first pull-down transistor (PD-1) pass through the SOI The first connection active region SL-1 of the substrate is connected, and the first connection active region SL-1 is connected with the source of the first transfer gate transistor (PG-1); the second pull-up transistor (PU- 2) It is connected with the drain of the second pull-down transistor (PD-2) through the second connection active area SL-2 of the SOI substrate, and the second connection active area SL-2 is connected with the second transfer gate transistor (PD-2) at the same time. The sources of PG-2) are connected to each other without using the first metal layer to realize the interconnection of each transistor, thereby saving one metal layer.

A method for connecting FPC to a second circuit board, comprising the steps of (i) preparing a flexible printed circuit board (FPC) and a second circuit board, (ii) disposing the connection parts of the FPC to face the connection parts of the second circuit board such that a thermosetting adhesive film is present between the connection parts of the FPC and the connection parts of the second circuit board, and (iii) applying heat and pressure sufficiently high to thoroughly push away the adhesive film for establishing electrical contact and allow for curing of the adhesive, wherein the ratio of conductor width (L) / conductor-to-conductor distance (S) in the conductor wiring end parts constituting the connection parts of FPC is 0.5 or less and the thermosetting adhesive film is adjusted to have a viscosity of 500 to 20,000 Pa.s at 200° C.

The invention provides a pixel structure comprising a scanning line, a data line, a grid electrode, a source electrode, a drain electrode and a pixel electrode, wherein the scanning wire and the data line are staggered with each other and electrically insulated; the grid electrode is electrically connected with the scanning line; at least part of the source electrode is positioned on the grid electrode and connected to the data line; the drain electrode is at least partially positioned on the grid electrode and opposite to the source electrode; and the pixel electrode comprises a main body part and an extended part, the main body part is electrically connected with the drain electrode, the extended part is electrically connected with the main body part, and the extended part is partially overlapped with the grid electrode and the drain electrode.

The invention discloses a 5G (5th-Generation) communication network communication tower. The 5G communication network communication tower structurally comprises a signal rod, a ball, a windproof mechanism, an underframe, and inclined struts, wherein the underframe is arranged at the middle of the bottom of the windproof mechanism and is vertically and mechanically connected to the windproof mechanism; more than two inclined struts are arranged on the periphery of the underframe and are fixed to the underframe; a signal transceiver is arranged inside the windproof mechanism; and the ball is arranged right above the signal transceiver. A hollow sleeve cooperates with an internal supporting umbrella for intercepting conductive and semi-conductive light materials such as plastic films in fields, broken tree branches, and discarded long recording tapes blown by strong winds, to be blown to lines, and for avoiding bird trouble and kite flying or certain artificial littering into the air. Theinternal supporting umbrella is designed with a narrow upper part and a wide lower part; the signal transceiver is located under the internal supporting umbrella; when rain falls on the internal supporting umbrella, the rain slides downwards along the slope side of the internal supporting umbrella, and does not enter the signal transceiver to cause the serious short-circuiting.

The present invention relates to a laminate for a light emitting device, comprising a glass substrate, a random network of reliefs formed on the glass substrate, and a flattening layer formed on the network, wherein the network of reliefs are formed from a glass frit. The laminate for a light emitting device according to the invention is characterized by comprising a network inducing the scattering of light for efficiently extracting outward a loss of light at an interface between a glass substrate and an internal light extraction layer. The laminate is suitable for the industrial field of optical devices, such as organic light emitting diodes (OLEDs), backlights, lighting, and the like.

A large-current USB Type C socket comprises a metal medium plate which is provided with a body part, a first terminal group and a second terminal group which are respectively arranged at the upper and lower sides of the metal medium plate and are symmetrical, and an insulating body which integrally molds the first and second terminal groups and the metal medium plate. The first and second terminal groups comprise two first grounding terminals and two second grounding terminals at the outmost side, a plurality of first signal terminals and two first power terminals between the two first grounding terminals, and a plurality of second signal terminals and two second power terminals between the two second grounding terminals, wherein the first and second power terminals are thicker than the first and second signal terminals. The metal medium plate is provided with strip holes in positions corresponding to the first and second power terminals. The large-current USB Type C socket of the application can effectively support large-current charging.

The invention relates to a shallow trench isolation structure and a forming method thereof, the method comprises the following steps: a base plate is provided; a trench with a wider upper part and a narrower lower part is formed on the base plate; a first dielectric layer is formed so as to cover the upper part of the internal wall of the trench; a first etching process is executed so as to ensure that the internal wall of the trench which is not covered by the first dielectric layer is receded; the first dielectric layer is removed; and a second dielectric layer is formed so as to cover the trench and form a hollow hole in the trench.

The invention discloses a power battery top cover based on a tab direct-leading type flat welding structure. The power battery top cover comprises a metal hard connection part, a metal protection sheet, an upper cover plate, upper plastic and two electrode columns, wherein the metal protection sheet is connected with the metal hard connection part through a tab of a naked battery cell; the upper cover plate is fixed on the upper plastic; the upper cover plate is matched with the upper plastic; one end of each electrode column is electrically connected with the metal hard connection part and the other end of each electrode column penetrates through the upper plastic and the upper cover plate; the electrode columns are in sealing connection with the upper plastic. The upper plastic is used for replacing a retainer and the occupied space of the retainer is reduced; the inner space utilization rate of a battery is improved and the energy density of the battery is improved by 70 percent atleast; after the retainer is cancelled, the naked battery cell and an electrode of a top cover plate do not need to be connected through a metal conductor, so that the distance of a circuit is shortened, the inner resistance of the battery is reduced and the rate performance is improved; meanwhile, the heat generated by the inner resistance is greatly reduced and the safety performance of the battery is improved.

The invention relates to a multi-gear vacuum on-load tap switch. The multi-gear vacuum on-load tap switch consists of two portions, i.e. a toggle switch and a selector switch, wherein the selector switch comprises a moving mechanism of a movable contact module consisting of a stepper motor, a lead screw and a lead screw pair and a gear selection mechanism consisting of a movable contact and multiple groups of static contacts; the static contacts of the selector switch are divided into an odd number group and an even number group, the static contacts of the odd number group contact a D movable contact, and the static contacts of the even number contact an S group of movable contacts; and the toggle switch comprises a permanent magnetic mechanism and a switching module, the access or a main circuit or the access of an auxiliary circuit is rapidly changed by virtue of an electromagnetic coil arranged on the switching module, the switching module is provided with two groups of vacuum pipes, the main circuit is provided with a main vacuum pipe, and the auxiliary circuit consists of the main vacuum pipe and a transition resistor which are connected in series. The multi-gear vacuum on-load tap switch is high in automation degree, simple in structure, and convenient to install and repair. The number of gears is not limited, and the size is smaller relative to a volume drum-type tap switch.

The invention aims at providing a practical equalizing charge charging device which is different from most of equalized charging methods adopted at present. According to the equalizing charge principle of an incremental equalizing charge battery pack charging device, when a main charging loop normally conducts charging, all single batteries are patrolled, the battery which is least charged is found, the incremental charging is conducted on the battery, the charging speed of the battery is increased, and the equalizing charge of all the single batteries is achieved. By means of the charging method, the problem of the unnecessary electric energy waste caused by an equalized energy consumption type charging method and the problem that an equalized energy consumption type charging circuit is complex and hard to control are solved. In order to solve the problem that due to the fact that wrong connection exists in an energy supplementation type gating switch array, short-circuit accidents are caused, incremental auxiliary charging current switching is conducted through a current circuit changer structure, it is ensured that only one battery is selected and connected to an incremental current generator under all conditions, and no short circuits between batteries can be caused. In order to better conduct auxiliary incremental charging on the batteries, a voltage source auxiliary charging power supply which is used at present is replaced with an auxiliary current source.

The conducting lug and re-distributed wire layer configuration includes several power source connecting conducting lugs and earthing conducting lugs in honeycomb arrangement inside the chip, several power source, wires in 60 deg connected to the poer source connecting cnoducting lugs and several earthing wires in 60 deg connected to the earthing conducting lugs. The power source wires and the earthing wires crossed in the inner power bar and earthing bar have greater crossing probability. The conducting lugs are arranged in array mode, and the earthing and power source wires are in the re-distributed wire layer.

To provide a method for connecting printed circuit boards with high connection reliability, while avoiding the problem of shorting even with a fine pitch. A method for connecting printed circuit boards (PCB) containing metal wiring, or connecting a printed circuit board (PCB) containing metal wiring with a metal lead wire or a metal contact, which method includes a step of thermocompression bonding of an adhesive film with connectors, the adhesive film being composed of an adhesive composition comprising a thermoplastic resin and organic particles, wherein the viscosity decreases as the applied thermocompression force increases at a temperature of 100-250 DEG C.

Disclosed herein is a transparent electrode, including: a polyimide film having an average linear thermal expansion coefficient of 50.0 ppm / DEG C or less, which is measured by thermo-mechanical analysis based on a film thickness of 50 to 100 [mu]m at a temperature of 50 to 250 DEG C, and a yellowness of 15 or less; and an electrode layer including a conductive material and a polyimide resin having an average linear thermal expansion coefficient of 50.0 ppm / DEG C or less, which is measured by thermo-mechanical analysis based on a film thickness of 50 to 100 [mu]m at a temperature of 50 to 250 DEG C, and a yellowness of 15 or less. The transparent electrode is advantageous in that a problem of a short circuit does not occur even when apparatuses including this transparent electrode are over-heated because it has excellent heat resistance, and in that it is transparent and has high electroconductivity.

The invention relates to a flexible carbon fiber self-heating element which is of a multilayered structure and is further filled with a heat-resisting insulation material. The flexible carbon fiber self-heating element comprises a carbon fiber woven composite material outer layer, a heat-resisting insulation layer and a plurality of side-by-side carbon fiber flexible heating cables from outside to inside. The multiple carbon fiber flexible heating cables are also of a multilayered structure consisting of surface heat-resisting insulation layers and inner continuous carbon fiber heating wires. The flexible continuous carbon fiber self-heating element prepared through the structure has a stable heating temperature, the length can be cut flexibly as required, the flexible carbon fiber self-heating element can be widely applied to viscosity reduction of thickened oil or heat preservation of oil conveying pipelines in the oil production field, and the power-on heating temperature can reach 100-150 DEG C. The steps are simple, operation is convenient and practicability is high.

The invention relates to a treatment process for removing grease from the inner surface of a cold rolled tube. The process comprises the following steps of: preparing liquid, removing grease, washing with clean water and purging. The treatment process has the advantages that: as an electrolytic cleaning method is not adopted, the problem of short circuit is avoided; self-developed equipment instead of special equipment is adopted, and the requirement on washing space is low; the washing effect is good and the tube is not damaged; and a plurality of tubes can be washed simultaneously and production efficiency is greatly improved.

The invention discloses a high-power automobile rectifier bridge soldering method and a lug thereof. When diodes need to be soldered according to the conventional rectifier circuit connection method to form a high-power automobile rectifier bridge, the bases of the diodes are first fixedly embedded in a polar plate of the rectifier bridge, the polar plate is fixed on an insulating support of the rectifier bridge, lugs which are used for being soldered on the leads of the diodes to jointly form the high-power automobile rectifier bridge are respectively fixed beside each diode on the insulating support, the front soldering end of each lug is produced into the shape of a flat arrowhead, the butt-soldering method is then adopted to respectively solder the leads of the diodes on the soldering ends of the lugs fixed on the support, and thereby the high-power automobile rectifier bridge is formed. The invention not only has the advantages of lower soldering temperature and high product quality, but also has the advantages of simple structure, low production cost, small solder joints, material saving, high finished product rate and the like.

The invention discloses an inverted LED light source, which comprises a substrate and at least one LED chip, and is characterized in that the LED chip is combined with the front surface of the substrate through a first surface with an electrode, and a second surface of the LED chip is a light emitting surface and is opposite to the first surface; and at least one pair of P electrodes and N electrodes of at least one LED chip are in heat conduction connection with the front face of the substrate through a plurality of heat conductors arranged at intervals, and the maximum size a of any heat conductor in the direction parallel to the first surface is smaller than the minimum distance d between the P electrodes and the N electrodes. According to the flip-chip LED light source provided by theinvention, a flip-chip bonding technology and a self-alignment isolation technology are combined, so that the chip yield is improved, and the thermal expansion stress of a welding interface is reduced; and meanwhile, the requirement on the alignment precision of equipment is reduced, so that the production cost is reduced, and the yield is improved.

The invention discloses an anti-microbial flexible modular heating floor-heating device which comprises a floor layer and a high-temperature-resistant insulating layer arranged up and down. A heatinglayer is arranged in an interlayer between the floor layer and the high-temperature-resistant insulating layer, and comprises a heating module; the heating module comprises a first high-temperature-resistant insulating layer, a conductive heating layer, an electrode layer and a second high-temperature-resistant insulating layer sequentially arranged from top to bottom; the conductive heating layeris a graphene silver nanowire slurry layer; a graphene silver nanowire slurry is coated on the second high-temperature-resistant insulating layer with the electrode layer by adopting a silk-screen printing process and is dried at high temperature so as to form the graphene silver nanowire slurry layer; multiple holes are formed in the graphene silver nanowire slurry layer; and the electrode layeris connected to a conductor jointer through a conductor, and the conductor jointer is externally connected with a power supply, so that the graphene silver nanowire slurry layer is powered and heated. The anti-microbial flexible modular heating floor-heating device provided by the invention has the advantages of uniformity in heating, and simplicity and convenience in installation and maintenance.

A method for connecting circuit boards, comprising: (i) preparing a first circuit board having connection parts assigned to end parts of a plurality of conductor wirings, and a second circuit board having connection parts assigned to corresponding end parts of a plurality of conductor wirings; (ii) disposing the connection parts of the first circuit board to face the connection parts of the second circuit board with a thermosetting adhesive film between the connection parts of the circuit boards; and (iii) applying heat and pressure to the connection parts and to the thermosetting adhesive film sufficiently high to thoroughly push away the adhesive film so as to establish electrical contact between connection parts of the circuit boards facing each other and to allow for curing of the adhesive; wherein the conductor wirings constituting the connection parts of at least one of the first and second circuit boards contain non-linear wirings.

The invention discloses a high-strength low-resistivity high-voltage transmission power cable, which comprises three conductors, conductor shielding layers, an insulated layer, a protection layer, a cylindrical fixing device, a remote breakpoint detection unit and N terminal breakpoint detection units, wherein the conductor shielding layers are arranged outside the conductors; the insulated layers are arranged outside the conductor shielding layers; the three conductors are arranged in the protection layer; the cylindrical fixing device is located in the protection layer; the side surface of the cylindrical fixing device is provided with three arc-shaped grooves at equal intervals; the three conductors are respectively located in the arc-shaped grooves; the cavity formed between the conductors, the cylindrical fixing device and the protection layer is filled with an insulated filler; and the N terminal breakpoint detection units are arranged on the high-strength low-resistivity high-voltage transmission power cable line at equal intervals. The problem of short circuit caused by friction does not happen, the breakpoint can be quickly judged once the broken circuit problem happens to the power cable, and the wire core has high strength and low resistivity.