Method for mutually connecting circuit boards

A technology of interconnection and circuit board, which is applied in the direction of circuit, electrical component assembly printed circuit, printed circuit, etc., and can solve the problem of increasing production steps

Inactive Publication Date: 2008-06-25
3M INNOVATIVE PROPERTIES CO
View PDF1 Cites 2 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The above-mentioned method requires processing such as embossing to be applied t

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Method for mutually connecting circuit boards
  • Method for mutually connecting circuit boards
  • Method for mutually connecting circuit boards

Examples

Experimental program
Comparison scheme
Effect test

example

[0042] The compositions shown in Table 1 below were coated on a polyester film treated with silicone resin, and dried to form a film having a thickness of 30 μm.

[0043] Table 1

[0044] Table 1: Resin Composition

[0045] Element

parts by weight

YP50S

30

DER332

34

G402

30

BAFL

16.4

MC600

20

EXL2314

80

THF

600

[0046] Phenoxy resin:

[0047] YP50S, manufactured by Tohto Kasei Co., Ltd., average molecular weight: 11,800

[0048] Epoxy resin:

[0049] DER332, manufactured by Japan Dow Chemical Co., Ltd., amount of epoxy: 174

[0050] Polycaprolactone modified epoxy resin:

[0051] G402, manufactured by Daicel Chemical Industry Co., Ltd., amount of epoxy: 1,350

[0052] Diphenylamine fluorene:

[0053] BAFL, Nippon Steel Chemical Co., Ltd.

[0054] Melamine isocyanurate complex:

[0055] MC-600, manufactured by Nissan Chemical Industry Co., Ltd.

[0056] Ac...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

PropertyMeasurementUnit
Viscosityaaaaaaaaaa
Login to view more

Abstract

A method for connecting circuit boards, comprising: (i) preparing a first circuit board having connection parts assigned to end parts of a plurality of conductor wirings, and a second circuit board having connection parts assigned to corresponding end parts of a plurality of conductor wirings; (ii) disposing the connection parts of the first circuit board to face the connection parts of the second circuit board with a thermosetting adhesive film between the connection parts of the circuit boards; and (iii) applying heat and pressure to the connection parts and to the thermosetting adhesive film sufficiently high to thoroughly push away the adhesive film so as to establish electrical contact between connection parts of the circuit boards facing each other and to allow for curing of the adhesive; wherein the conductor wirings constituting the connection parts of at least one of the first and second circuit boards contain non-linear wirings.

Description

technical field [0001] The invention relates to a method for interconnecting circuit boards. Background technique [0002] In electronic equipment such as digital cameras, cellular phones, and printers, circuit boards obtained by bonding flexible circuit boards such as flexible printed circuit boards (FPC) to each other are used in many cases. The size of these electronic devices has decreased and the need for circuit boards interconnecting wiring with fine pitches has increased. [0003] Conventionally, connecting a circuit board to another circuit board is performed by providing solder bumps on a connection portion of the circuit board, and contacting and soldering the connection portion to electrodes of the other circuit board. However, the pitch between connection parts on the FPC becomes finer, and as the pitch becomes finer, problems such as short circuit occur between adjacent connection parts. Also, when the pitch is fine, the physical strength of the part for conn...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
IPC IPC(8): H05K3/36
CPCH05K3/361H05K3/305H05K2201/10977H01L2224/73204H05K1/117H05K2201/09427H01L2224/83101H05K2201/09245H05K3/365H05K2203/1189H05K2201/09263Y10T29/49126Y10T29/49174Y10T29/49147Y10T29/49149Y10T29/49195Y10T29/49179H05K1/11H05K3/36
Inventor 佐藤义明川手恒一郎詹姆斯·R·怀特
Owner 3M INNOVATIVE PROPERTIES CO
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap