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Method for connecting flexible printed circuit board to another circuit board

A flexible printing and circuit board technology, applied in the direction of printed circuit, printed circuit, printed circuit manufacturing, etc., can solve problems such as short circuit, and achieve the effect of improved connection reliability and highly reliable connection

Inactive Publication Date: 2008-03-05
3M INNOVATIVE PROPERTIES CO
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, since conductive particles are used, there is a risk of causing a short circuit in the case of connecting thin wires

Method used

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  • Method for connecting flexible printed circuit board to another circuit board
  • Method for connecting flexible printed circuit board to another circuit board

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Experimental program
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Effect test

Embodiment

[0045] The compositions shown in Table 1 below were coated on a silicone-treated polyester film and dried to form a film having a thickness of 30 μm.

[0046] Table 1: Resin Composition

[0047] Element

parts by weight

YP50S

30

DER332

34

G402

30

BAFL

16.4

MC-600

20

EXL2314

80

THF

600

[0048] Phenoxy resin: YP50S, manufactured by Tohto Kasei Co., Ltd., number average molecular weight 11800

[0049] Epoxy resin: DER332, manufactured by Dow Chemical Japan Ltd., epoxy equivalent 174

[0050] Polycaprolactone-modified epoxy resin: G-402, manufactured by Daicel Chemical Industries, Ltd., epoxy equivalent 1350

[0051] Dianiline fluorene: BAFL, Nippon Steel Chemical Co., Ltd.

[0052] Melamine / isocyanuric acid complex: MC600, manufactured by Nissan Chemicals Industries, Ltd.

[0053] Acryl particles: EXL-23 14, EXL2314, KUREHA PARALOID EXL, manufactured by Kureha Chemical Industry C...

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Abstract

A method for connecting FPC to a second circuit board, comprising the steps of (i) preparing a flexible printed circuit board (FPC) and a second circuit board, (ii) disposing the connection parts of the FPC to face the connection parts of the second circuit board such that a thermosetting adhesive film is present between the connection parts of the FPC and the connection parts of the second circuit board, and (iii) applying heat and pressure sufficiently high to thoroughly push away the adhesive film for establishing electrical contact and allow for curing of the adhesive, wherein the ratio of conductor width (L) / conductor-to-conductor distance (S) in the conductor wiring end parts constituting the connection parts of FPC is 0.5 or less and the thermosetting adhesive film is adjusted to have a viscosity of 500 to 20,000 Pa.s at 200° C.

Description

technical field [0001] The present invention relates to a method for connecting a flexible printed circuit board (FPC) to another circuit board. Background technique [0002] In many cases, electronic devices such as digital cameras, mobile phones, and printers use a flexible circuit board (FPC, hereinafter sometimes simply referred to as "FPC") connected to another circuit board. These electronic devices have become smaller, and it has been increasingly required to connect an FPC with fine-pitch wiring to another wiring board. [0003] In the past, the FPC was generally connected to another circuit board by providing solder bumps on a connection portion of the FPC, bringing the connection portion into contact with electrodes of the other circuit board and soldering, thereby establishing connection. However, the pitch between the connection parts on the FPC starts to be miniaturized, and as the pitch becomes smaller, problems such as short circuit are likely to occur betwee...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01R12/08H01R12/24
CPCH05K1/111H05K3/361H01R12/61H05K2201/09381H05K2201/10977H05K2201/09727H01R12/62H05K3/305H05K2203/1189H05K2201/09427H05K3/36
Inventor 川手恒一郎佐藤义明雄二平泽
Owner 3M INNOVATIVE PROPERTIES CO
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