Method of microelectrode connection and connected structure of use thereof

A technology for connecting structures and electrodes, applied in circuits, electrical components, printed circuits, etc., to solve problems such as interconnection, electrode short-circuit, and circuit board failure.
CN1675754AInactive Publication Date: 2005-09-28H&S HIGH TECH

Patent Information

Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
H&S HIGH TECH
Publication Date
2005-09-28
Estimated Expiration
Not applicable · inactive patent

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Abstract

Disclosed is a method for connecting microcircuits formed in a circuit board, such as a Tape Carrier Package (TCP), a Flexible Printed Circuit (FPC), a Liquid Crystal Display (LCD) or a printed circuit board using an anisotropic conductive adhesive including conductive particles, and the connection structure manufactured by the above method. The method comprises the steps of applying an insulating film layer to a circuit board having circuit patterns, and then boding them with an anisotropic conduction adhesive. The circuits that should not be connected by conductive particles included in the anisotropic conductive adhesive are prevented from a short-circuit
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Description

technical field

[0001] The present invention relates to a kind of microcircuit connection method and the connection structure by this method, relate in particular to a kind of tape carrier package (TCP) that is used to connect and form on the circuit board (such as utilizing the anisotropic conductive adhesive that contains conductive particle) , flexible printed circuit (FPC), liquid crystal display (LCD) or printed circuit board) microcircuit method and the connection structure made by the above method. Background technique

[0002] In the field of semiconductor packaging or liquid crystal displays, adhesives are used to secure chips to boards or for interconnection of circuits. When connecting a liquid crystal display panel to a tape carrier package (TCP) or a flexible printed circuit (FPC), or connecting a printed circuit board to a TCP or FPC, an anisotropic conductive adhesive containing conductive particles is used. Recently, anisotropic conductive adhesives can be d...

Claims

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