Method of microelectrode connection and connected structure of use thereof
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- H&S HIGH TECH
- Publication Date
- 2005-09-28
- Estimated Expiration
- Not applicable · inactive patent
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Abstract
Description
technical field
[0001] The present invention relates to a kind of microcircuit connection method and the connection structure by this method, relate in particular to a kind of tape carrier package (TCP) that is used to connect and form on the circuit board (such as utilizing the anisotropic conductive adhesive that contains conductive particle) , flexible printed circuit (FPC), liquid crystal display (LCD) or printed circuit board) microcircuit method and the connection structure made by the above method. Background technique
[0002] In the field of semiconductor packaging or liquid crystal displays, adhesives are used to secure chips to boards or for interconnection of circuits. When connecting a liquid crystal display panel to a tape carrier package (TCP) or a flexible printed circuit (FPC), or connecting a printed circuit board to a TCP or FPC, an anisotropic conductive adhesive containing conductive particles is used. Recently, anisotropic conductive adhesives can be d...