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Method of microelectrode connection and connected structure of use thereof

A technology for connecting structures and electrodes, applied in circuits, electrical components, printed circuits, etc., to solve problems such as interconnection, electrode short-circuit, and circuit board failure.

Inactive Publication Date: 2005-09-28
H&S HIGH TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, since the resin particles are coated with the metal component, the anisotropic conductive adhesive including the resin particles coated with the metal component also causes a short circuit of electrodes that should not be connected, so that the circuit board cannot be properly performed. interconnected

Method used

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  • Method of microelectrode connection and connected structure of use thereof
  • Method of microelectrode connection and connected structure of use thereof
  • Method of microelectrode connection and connected structure of use thereof

Examples

Experimental program
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Embodiment 1

[0055] Polyester resin (Toyobo Co., Vylon200 TM ) is dissolved in a mixed solvent in which ketone and toluene are mixed in a weight ratio of 3:1 to prepare a solution with a solid content of 25%. Next, the resin solution was applied to the electrode portion of TCP having a line width of 30 μm, a pitch of 60 μm, and a thickness of 18 μm using a screen printer. Then, the TCP coated with the resin solution was dried in an oven at 70° C. by hot air for 5 minutes, so as to obtain the TCP coated with the insulating film. Thereafter, the thickness of the insulating film was measured to be 1 μm using a micrometer.

Embodiment 2

[0057] Adopt the same method as embodiment 1 to prepare the TCP that is coated with insulating film, difference is: vinyl acetate resin (Okong bond Co., PVAc302 TM ) was dissolved in a mixed solvent of methyl ethyl ketone and toluene mixed at a weight ratio of 3:1 to prepare a solution with a solid content of 25%. Then, a TCP coated with an insulating film having a thickness of 1 μm was produced by the method of Example 1.

Embodiment 3

[0059] Adopt the same method as embodiment 1 to prepare the TCP that is coated with insulating film, difference is: the nitro polybutadiene rubber (Nippon zeon Co., Nippol FN4002 TM ) was dissolved in a mixed solvent mixed with methyl ethyl ketone and toluene at a weight ratio of 3:1 to prepare a solution with a solid content of 25%. Then, by the method of Example 1, a TCP coated with an insulating film having a thickness of 1 µm was produced.

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Abstract

Disclosed is a method for connecting microcircuits formed in a circuit board, such as a Tape Carrier Package (TCP), a Flexible Printed Circuit (FPC), a Liquid Crystal Display (LCD) or a printed circuit board using an anisotropic conductive adhesive including conductive particles, and the connection structure manufactured by the above method. The method comprises the steps of applying an insulating film layer to a circuit board having circuit patterns, and then boding them with an anisotropic conduction adhesive. The circuits that should not be connected by conductive particles included in the anisotropic conductive adhesive are prevented from a short-circuit

Description

technical field [0001] The present invention relates to a kind of microcircuit connection method and the connection structure by this method, relate in particular to a kind of tape carrier package (TCP) that is used to connect and form on the circuit board (such as utilizing the anisotropic conductive adhesive that contains conductive particle) , flexible printed circuit (FPC), liquid crystal display (LCD) or printed circuit board) microcircuit method and the connection structure made by the above method. Background technique [0002] In the field of semiconductor packaging or liquid crystal displays, adhesives are used to secure chips to boards or for interconnection of circuits. When connecting a liquid crystal display panel to a tape carrier package (TCP) or a flexible printed circuit (FPC), or connecting a printed circuit board to a TCP or FPC, an anisotropic conductive adhesive containing conductive particles is used. Recently, anisotropic conductive adhesives can be d...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/60H01L23/498H05K3/32H05K3/36
CPCH01L2924/01027H05K2203/1189H01L24/83H01L2924/0781H01L2224/2929H01L2924/01058H01L2924/01061H01L2924/01045H01L2224/83101H01L2224/29455H05K3/323H01L2924/01015H01L2224/29444H01L23/4985H01L2924/00013H01L2224/2989H05K2203/0759H01L2924/01006H01L2224/81903H01L2924/01078H01L2924/01079H01L2224/16H01L2224/8319H01L2924/01005H01L2224/73204H01L2224/2919H01L2224/83851H01L2224/2939H01L2224/29399H01L2924/07811H05K3/361H01L2224/13016H01L24/29H01L2224/838H01L2924/01033H01L2924/0665H01L2924/07802H01L2924/00014H01L2224/29099H01L2924/00H01L21/60
Inventor 卞廷日李坰埈李明圭查克西恩·彼得
Owner H&S HIGH TECH
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