Microresistor assembly

Abstract

The invention relates to a microresistor assembly comprising a resistor body, a first protective layer, a heat conducting layer, a second protective layer and two electrode layers, wherein the resistor body is provided with a first end part, a second end part and a center part, wherein the first end part and the second end part are opposite, and the center part is positioned between the first endpart and the second end part; the resistor body defines a center line; the first protective layer is arranged on a part of the center part of the resistor body and exposes the first end part and the second end part; the heat conducting layer is formed on a part of the resistor body in a depositing way; the second protective layer are arranged on a part of the heat conducting layer; and the two electrode layers respectively wrap the first end part and the second end part of the resistor body and are electrically connected with the heat conducting layer.

Description

technical field [0001] The invention relates to an electronic component, in particular to a micro-resistance component. Background technique [0002] With the continuous development of electronic circuit technology, the requirement for the stability of the resistance value of the resistance component is increasingly higher. The temperature coefficient of resistance (Temperature Coefficient of Resistance, TCR) and other properties of traditional chip resistor components have gradually been unable to meet the requirements of high stability, which has limited their applications. [0003] In order to improve the thermal stability of the resistance value of the resistance component, Taiwan Invention Patent Publication No. 200830333 and No. 200830334 propose a micro-resistor component. By forming a high-performance radiator on one side of the resistance component body, the heat energy on the resistance component body is dissipated, so as to achieve the purpose of improving the op...

AI Technical Summary

Problems solved by technology

During the stamping process, there will be burrs or protrusions on the surface of the body and the heat sink. These burrs or protrusions may pierce the adhesive layer (thickness is about 30 μm) used for pressing or adhesion during the bonding process of the body and the heat sink. A short circuit is formed in contact with the heat sink, resulting in the resistance value of the micro-resistance component failing to meet the preset requirements

Furthermore, the micro-resistance component uses two rectangular heat sinks symmetrically arranged at both ends of the body, so it can only take away the heat energy at both ends of the body, but cannot take away the heat energy of the central part of the body with a higher temperature, so the body The heat dissipation effect on the surface is limited, so that the operating power that can be increased is limited

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