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Height adjustable heat dissipation pad

A cooling pad and adjustable technology, applied in the direction of instruments, electrical digital data processing, digital data processing components, etc., can solve the problems of fixed structure, inability to adjust the height of the cooling pad, the height of the desktop and the cooling pad cannot reach the user, etc. Achieve the effect of increasing comfort and preventing cervical spondylosis

Inactive Publication Date: 2017-01-04
TIANJIN HEYONGXING SCI & TECH DEV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The existing cooling pads for notebooks have a relatively fixed structure, and the height of the cooling pad cannot be adjusted, but often the height of the desktop and the cooling pad cannot reach the most suitable height for the user

Method used

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  • Height adjustable heat dissipation pad
  • Height adjustable heat dissipation pad

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Experimental program
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Embodiment

[0014] A height-adjustable heat dissipation pad, comprising a base 1, a heat dissipation mesh surface 2, and a heat dissipation device 3, the base 1 is provided with a heat dissipation mesh surface 2, four corners of the heat dissipation mesh surface 2 are provided with pillars 4, and the four corners of the base 1 Both are provided with pillar grooves 5, pillars 4 are arranged in the pillar grooves 5, the pillars 4 are evenly provided with fixing grooves 6, the pillar grooves 5 are provided with a fixer 7, and the base 1 is provided with a cooling device 3. The cooling device is a fan. An anti-slip protrusion 8 is provided on the panel of the base 1 in contact with the desktop. The height of the heat dissipation mesh surface 2 is fixed by the fixing groove 6 and the fixer 7 , and the heat dissipation is carried out by the heat dissipation device 3 .

[0015] Use case:

[0016] The height of the heat dissipation mesh surface 2 is adjusted by the cooperation of the pillar gro...

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Abstract

The invention belongs to the field of computer accessories, and particularly relates to a height adjustable heat dissipation pad. The height adjustable heat dissipation pad comprises a base, a heat dissipation net surface and a heat dissipation device, wherein the heat dissipation net surface is arranged on the base, support pillars are arranged at the four corners of the heat dissipation net surface, support pillar grooves are arranged at the four corners of the base, the support pillars are arranged in the support pillar grooves, and are uniformly provided with fixing grooves, fixing devices are arranged in the support pillar grooves, and the heat dissipation device is arranged on the base; the heat dissipation device is a fan; anti-skidding bulges are arranged on a panel of the base, contacting a desktop. Due to the adoption of the technical scheme, the height of the heat dissipation pad of a notebook computer can be adjusted, and a user can adjust the height of the heat dissipation pad according to self demands to reach the optimal use height, so that the cervical spondylosis can be prevented, and the comfort of the user can be improved.

Description

technical field [0001] The invention belongs to the field of computer accessories, in particular to a height-adjustable cooling pad. Background technique [0002] Compared with the desktop computer in the existing technology, the basic composition of the notebook computer is the same, but the advantage of the notebook computer is still very obvious. Portability is the biggest advantage of notebooks over desktop computers. The weight of a general notebook computer is only a little more than 2 kg. Whether it is going out for work or traveling, it can be carried with you, which is very convenient. For notebook computers, in the confrontation between performance and portability, heat dissipation has become the most critical factor. Notebook heat dissipation has always been the bottleneck in the core technology of notebook computers. In order to solve this problem, people have designed heat dissipation bases. life. The existing cooling pads for notebooks have a relatively fixed...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G06F1/20G06F1/16
Inventor 刘建李力崔欣岳
Owner TIANJIN HEYONGXING SCI & TECH DEV