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Semiconductor wrapper and manufacturing method thereof

A package and semiconductor technology, which is applied in semiconductor/solid-state device manufacturing, semiconductor devices, semiconductor/solid-state device components, etc., can solve the problems of chips affecting work efficiency and poor thermal conductivity of packages, etc.

Active Publication Date: 2017-01-04
ADVANCED SEMICON ENG INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the chip generates high heat, and the thermal conductivity of the package is usually not good, resulting in excessive temperature around the chip and affecting its working efficiency

Method used

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  • Semiconductor wrapper and manufacturing method thereof
  • Semiconductor wrapper and manufacturing method thereof
  • Semiconductor wrapper and manufacturing method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0050] Please refer to Figure 1A , which shows a cross-sectional view of a semiconductor package according to an embodiment of the present invention. The semiconductor package 100 includes a chip 110 , a package body 120 , a conductive element 130 , a shielding film 140 and solder balls 150 .

[0051] The chip 110 has an active surface 110a and a back surface 110b opposite to each other. The chip 110 is disposed on the conductive element 130 with the active surface 110a facing downward, and is in direct or indirect contact with the conductive element 130, so as to be electrically connected to the solder ball through the conductive element 130. 150.

[0052] The chip 110 may have a single-layer or multi-layer structure. The chip 110 further includes at least one heat sink 111 , wherein the heat sink 111 extends from the active surface 110 a of the chip 110 to the back surface 110 b of the chip 110 , that is, the heat sink 111 runs through the chip 110 . In this example, the ...

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PUM

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Abstract

The invention relates to a semiconductor wrapper and a manufacturing method thereof. The semiconductor wrapper comprises a chip, a wrapper body, a conducting piece and a shielding membrane. The chip is arranged on the conducting piece and is provided with a heat dissipation piece running through the chip. The wrapper body wraps the chip and the conducting piece and has an outer side surface, and an upper surface and a lower surface which are opposite to each other, and the wrapper body has a first heat dissipation hole and a second heat dissipation hole. The first heat dissipation hole extends to the upper surface of the wrapper body from the heat dissipation piece, and the second heat dissipation hole extends to a zone outside the heat dissipation piece on the chip from the upper surface of the wrapper body. The shielding film forms an upper surface and an outer side surface of the wrapper body and is electrically connected with the conducting piece.

Description

[0001] This application was filed on December 28, 2012, with the application number "201210583616.7", and the divisional application of the Chinese invention patent application titled "Semiconductor package and its manufacturing method" technical field [0002] The present invention relates to a semiconductor package and its manufacturing method, and in particular to a semiconductor package with heat dissipation holes and its manufacturing method. Background technique [0003] A traditional semiconductor package includes a package body and a chip, wherein the package body covers the chip, and the chip provides the function of the semiconductor package. However, the chip generates high heat, and the thermal conductivity of the package is usually poor, resulting in excessively high temperatures around the chip and affecting its working efficiency. Therefore, how to dissipate the heat of the chip has become one of the focuses of the industry. Contents of the invention [000...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L23/552H01L21/60
CPCH01L23/552H01L21/568H01L24/97H01L2224/13025H01L2224/16225H01L2224/16235H01L2224/2518H01L2224/48227H01L2224/48235H01L2224/73227H01L2224/73259H01L2224/97H01L2924/15311H01L2924/18161H01L2924/3025H01L2224/81H01L2224/85H01L2924/00
Inventor 沈家贤刘盈男
Owner ADVANCED SEMICON ENG INC