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A kind of rotating target and magnetron sputtering device

A technology of rotating target and rotating axis, applied in the field of magnetron sputtering, which can solve the problem that the target cannot be composed and adjusted

Active Publication Date: 2018-11-09
BOE TECH GRP CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0005] The embodiment of the present invention provides a rotating target and a magnetron sputtering device to solve the problem that the composition of the target cannot be adjusted after the mixed molding

Method used

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  • A kind of rotating target and magnetron sputtering device
  • A kind of rotating target and magnetron sputtering device
  • A kind of rotating target and magnetron sputtering device

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Embodiment Construction

[0036] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

[0037] An embodiment of the present invention provides a rotating target, such as Figure 2a As shown, the rotating target 01 includes a plurality of target units 10, and each target unit 10 is detachably connected around the rotation axis O-O' to form a closed structure.

[0038] It should be noted here that, firstly, the aforementioned rotary target 01 includes a plurality of target units 10 means that the rotary target 01 includes two or more target units 1...

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Abstract

The embodiment of the invention provides a rotating target and a magnetron sputtering device, relates to the technical field of magnetron sputtering, and aims to solve the problem that component adjustment cannot be performed after mixed forming of a target material. The rotating target comprises a plurality of target units, and all the target units are detachably connected around an axis of rotation to form a closed structure.

Description

technical field [0001] The invention relates to the technical field of magnetron sputtering, in particular to a rotating target and a magnetron sputtering device. Background technique [0002] Magnetron sputtering is a type of physical vapor deposition (Physical Vapor Deposition, PVD). Since magnetron sputtering can achieve high speed, low temperature and low damage, it has become a common technology for depositing thin films. [0003] The specific process of the magnetron sputtering method is that electrons are accelerated to fly to the substrate under the action of an electric field. During this process, they collide with argon atoms, which can ionize argon ions and electrons, and the argon ions accelerate to bombard the target surface under the action of an electric field. , a large number of target atoms or molecules are sputtered, and the neutral target atoms or molecules can be deposited on the substrate to form a film. On this basis, by introducing a magnetic field o...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C23C14/35
CPCC23C14/3407C23C14/35
Inventor 张斌詹裕程孙雪菲周婷婷舒适王新星
Owner BOE TECH GRP CO LTD
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