Integrated circuit package mechanism convenient to dissipate heat

Abstract

The invention discloses an integrated circuit package mechanism convenient to dissipate heat. The integrated circuit package mechanism comprises a substrate, wherein a heat dissipation plate is fixedly arranged on the substrate, a plurality of heat dissipation frame bodies are formed on the heat dissipation plate and encircle in a layer-by-layer way, a rectangular bearing seat is fixedly arranged at the middle of the heat dissipation frame body, a rectangular placing hole is formed in the center of the bearing seat, an integrated circuit chip is inserted into the placing hole, a plurality of heat sinks are inserted into and fixedly arranged on the heat dissipation frame body at an inner side of the heat dissipation plate, a plurality of heat dissipation through holes are formed in a lower end of each heat sink and communicate with an upper end surface of the heat dissipation plate, a plurality of connection holes are formed in the bearing seat, heat dissipation holes are formed in the heat dissipation frame bodies at two sides of the heat dissipation plate, a plurality of embedded grooves are formed in the upper end surface of the heat dissipation plate and transversely pass through the corresponding connection holes, the heat dissipation through holes and the heat dissipation holes, a cooling liquid pipe is embedded into the embedded grooves, a heat conduction ceramic ring sleeves an outer wall of the middle part of the cooling liquid pipe, and the integrated circuit chip props against the heat conduction ceramic ring. By the integrated circuit package mechanism, rapid heat dissipation can be achieved, and the service lifetime of an integrated circuit is prolonged.

Description

[0001] Technical field: [0002] The invention relates to the technical field of integrated circuits, in particular to an integrated circuit packaging mechanism that facilitates heat dissipation. [0003] Background technique: [0004] The electronics industry continues to reduce the size of electronic components and continue to increase functions on electronic components, which makes the functions and complexity of integrated circuits continue to increase. This trend also drives the packaging technology of integrated circuit components to develop in the direction of small size, high pin count and high electrical / thermal performance, and conforms to predetermined industrial standards. Since high-performance integrated circuit components generate higher heat, and the current small package technology only provides designers with a small heat dissipation mechanism, it is necessary to design a heat dissipation structure on its small package structure to facilitate heat dissipation ...

AI Technical Summary

Problems solved by technology

Since high-performance integrated circuit components generate higher heat, and the current small package technology only provides designers with a small heat dissipation mechanism, it is necessary to design a heat dissipation structure on its small package structure to facilitate heat dissipation and prolong the service life of integrated circuits , the heat dissipation effect of the heat dissipation structure on the existing small package structure is not ideal

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