The invention discloses an
integrated circuit package mechanism convenient to dissipate heat. The
integrated circuit package mechanism comprises a substrate, wherein a heat dissipation plate is fixedly arranged on the substrate, a plurality of heat dissipation frame bodies are formed on the heat dissipation plate and encircle in a layer-by-layer way, a rectangular bearing seat is fixedly arranged at the middle of the heat dissipation frame body, a rectangular placing hole is formed in the center of the bearing seat, an
integrated circuit chip is inserted into the placing hole, a plurality of heat sinks are inserted into and fixedly arranged on the heat dissipation frame body at an inner side of the heat dissipation plate, a plurality of heat dissipation through holes are formed in a lower end of each
heat sink and communicate with an upper end surface of the heat dissipation plate, a plurality of connection holes are formed in the bearing seat, heat dissipation holes are formed in the heat dissipation frame bodies at two sides of the heat dissipation plate, a plurality of embedded grooves are formed in the upper end surface of the heat dissipation plate and transversely pass through the corresponding connection holes, the heat dissipation through holes and the heat dissipation holes, a cooling liquid
pipe is embedded into the embedded grooves, a heat conduction
ceramic ring sleeves an outer wall of the middle part of the cooling liquid
pipe, and the integrated circuit
chip props against the heat conduction
ceramic ring. By the integrated circuit
package mechanism, rapid heat dissipation can be achieved, and the service lifetime of an integrated circuit is prolonged.