Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Wafer spraying device with height-adjustable supporting table

A technology of height adjustment and spraying device, applied in the direction of spraying device, etc., can solve the problems of uneven spraying and inability to adjust in real time, and achieve the effect of improving uniformity

Inactive Publication Date: 2017-01-18
WUXI HI NANO TECH
View PDF8 Cites 2 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The current spray structure can only adjust the height position of the sprinkler head before spraying, but it cannot be adjusted in real time during the spraying process. As a result, the height of the sprinkler head changes during the spraying process, resulting in uneven spraying The phenomenon

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Wafer spraying device with height-adjustable supporting table

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0011] The specific embodiments of the present invention will be further described below in conjunction with the accompanying drawings.

[0012] like figure 1 As shown, the height-adjustable wafer shower device of the support table in this embodiment includes a wafer support table 1 and a shower head mounting plate 2 located above the wafer support table 1, and the wafer support table 1 is composed of a plurality of support rods 3 support, the support rod 3 is fixedly installed on the upper end of the piston rod of the vertical cylinder 4, and the cylinder body of the vertical cylinder 4 is fixedly installed on the cylinder support platform 5; the spray head mounting plate 2 is fixed on the frame, and its lower surface A plurality of suspenders 6 are installed, and the lower end of the suspender 6 is equipped with a shower head 7 and a range finder 8; the present invention also includes a controller, the output end of the range finder 8 is connected with the input end of the c...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention relates to a wafer spraying device with a height-adjustable supporting table. The wafer spraying device comprises the wafer supporting table, a spraying head mounting plate located above the wafer supporting table, and a controller. The wafer supporting table is supported by a plurality of supporting rods. The supporting rods are fixedly mounted at the upper ends of piston rods of vertical cylinders. Cylinder blocks of the vertical cylinders are fixedly mounted on a cylinder supporting table. The spraying head mounting plate is fixed to a rack. A plurality of hanging rods are mounted on the lower surface of the spraying head mounting plate. A spraying head and a distance measuring instrument are mounted at the lower end of each hanging rod. The output ends of the distance measuring instruments are connected with the input end of the controller, and the output end of the controller is connected with travel control units of the vertical cylinders. According to the wafer spraying device with the height-adjustable supporting table, the spraying distance is detected and adjusted in real time, and the spraying uniformity is improved.

Description

technical field [0001] The invention relates to the technical field of integrated circuits, in particular to wafer spraying equipment. Background technique [0002] In the semiconductor coating process, the shower head is usually used to spray high-temperature metal gas against the wafer. In order to ensure the uniformity of the spray, the shower head needs to be leveled so that the distance between all the shower heads and the wafer is equal. The current spray structure can only adjust the height position of the sprinkler head before spraying, but it cannot be adjusted in real time during the spraying process. As a result, the height of the sprinkler head changes during the spraying process, resulting in uneven spraying The phenomenon. Contents of the invention [0003] In view of the above-mentioned problems existing in the prior art, the applicant conducted research and improvement, and provided a support table height-adjustable wafer spraying device, which can adjust ...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
IPC IPC(8): B05B13/00B05B15/10B05B13/02
CPCB05B13/00B05B13/0285B05B15/70
Inventor 吕耀安
Owner WUXI HI NANO TECH
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com