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Chip raw plate with hemispherical cavity and chip substrate

A hemispherical, chip technology, applied in the field of cavity chip originals, can solve problems such as processing difficulties and achieve the effect of reducing thickness

Inactive Publication Date: 2017-01-18
POINT ENG
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] However, there are difficulties in processing the hemispherical lens disclosed in Patent Document 1

Method used

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  • Chip raw plate with hemispherical cavity and chip substrate
  • Chip raw plate with hemispherical cavity and chip substrate
  • Chip raw plate with hemispherical cavity and chip substrate

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Embodiment Construction

[0041] The following description merely illustrates the principles of the invention. Even if not clearly described or shown in this specification, those skilled in the art can implement the principle of the present invention and create various devices within the concept and scope of the present invention. Conditional terms and examples appearing in this specification are only intended to enable the concept of the present invention to be understood, and they are not limited to the examples and conditions mentioned in the specification.

[0042] In order to enable people with common sense in the technical field of the present invention to easily implement the present invention, and to make the above-mentioned purpose, features and advantages of the present invention more obvious and understandable, the present invention will be further described in detail below in conjunction with the accompanying drawings and specific embodiments describe.

[0043] When describing the present ...

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Abstract

The invention relates to a chip raw plate and a chip substrate. The chip raw plate provided by the invention comprises conductive parts stacked in one direction, insulating parts stacked alternately with the conductive parts and electrically insulated from the conductive parts, and hemispherical cavities recessed at a predetermined depth in areas where the insulating parts are located. The hemispherical cavities are formed at each unit chip substrate. A number of unit chip substrates are formed by dividing the chip raw plate at the upper part of the chip raw plate. According to the invention, through a planar lens which is easily processed, optical element chip package with high illuminance at the center is realized; compared with package using a hemispherical lens, the package thickness can be reduced; and the thickness of a chip package device is reduced.

Description

technical field [0001] The invention relates to a chip original board and a chip substrate, and more specifically, relates to a chip original board with a cavity for mounting chips. Background technique [0002] In the past, in order to form a space for mounting chips on the chip original board, the upper surface of the chip original board was machined or chemically etched. That is, Korean Registered Patent No. 10-0986211 discloses a manufacturing method of forming a mounting space by etching the upper surface of an unprocessed square plate-shaped metal original plate. [0003] In addition, when mounting optical element chips such as UV or LED on these chip original boards, a space having a wide upper part and a narrow lower part is formed in order to improve light reflection performance. After these spaces are formed, when the chip is mounted in the space and the mounting space is sealed, the optical efficiency is improved by providing the lens. [0004] In addition, as f...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L23/498H01L33/48H01L33/62
Inventor 安范模全瑛雲俞京秀
Owner POINT ENG