Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Method on FLASH resource recovery of embedded device

A technology for embedded equipment and resource recovery, applied in the direction of instruments, electrical digital data processing, memory systems, etc., can solve problems such as untimely resource recovery and equipment failure to operate normally, and achieve the effect of ensuring safety and reliability.

Active Publication Date: 2017-01-25
XUJI GRP +5
View PDF4 Cites 9 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The purpose of the present invention is to propose a method for recycling FLASH resources of an embedded device, which is used to solve the technical problem that the device cannot operate normally due to the untimely recovery of background resources of the device

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Method on FLASH resource recovery of embedded device
  • Method on FLASH resource recovery of embedded device
  • Method on FLASH resource recovery of embedded device

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0020] The present invention will be described in detail below in conjunction with the accompanying drawings.

[0021] The method for recovering FLASH resources of an embedded device provided by the present invention determines the cleaning cycle of background resource recovery through the real-time detected CPU load rate and Flash space utilization rate, that is, the time interval for cleaning the memory of the device each time, and according to This particular cleanup cycle regularly cleans up memory.

[0022] Before introducing the method in detail, the scope of the cleaning cycle is firstly introduced in detail.

[0023] Such as figure 1 As shown, the cleaning cycles of background resource recovery of embedded devices are arranged in order of size, and the specific size of each cleaning cycle is determined by device characteristics such as CPU speed, CPU average load, FLASH space size, and FLASH space utilization. Among them, there is no specific theoretical formula for ...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention relates to a method on FLASH resource recovery of embedded device, comprising the steps of real-time detection of CUP load rate and space utilization rate of Flash; Determine cleaning cycle (time interval for cleaning) for back-end resource recovery based on CUP load rate and space utilization rate of Flash; the less CUP load rate, the shorter corresponding cleaning cycle. The more CUP load rate, the larger corresponding cleaning cycle, and the higher space utilization rate of Flash, the shorter corresponding cleaning cycle. The lower space utilization rate of Flash, the larger corresponding cleaning cycle; Conduct trash recycling according to determined cleaning cycle. Through adjusts the cleaning cycle for back-end resource recovery on a real time basis, the method on FLASH resource recovery of embedded deviceconducts timing recovery cleaning for FLASH resource so as to avoid abnormal operation of the equipment caused by inadequate effective resource.

Description

technical field [0001] The invention relates to a method for recovering FLASH resources of an embedded device, belonging to the technical field of embedded devices. Background technique [0002] Embedded devices have extremely high requirements on their own reliability. When some unpredictable factors or undiscovered potential dangers lead to untimely recovery of FLASH garbage resources, it will cause abnormal situations such as long time-consuming file operations, and even some The operation will not work properly, which will eventually lead to unpredictable dangers in embedded devices. In this case, it will be difficult to ensure the reliability and safety of equipment operation, and even cause serious consequences to the entire system. [0003] Therefore, reclaiming FLASH resources in a timely manner and avoiding the abnormal situation that the device cannot operate normally due to insufficient effective resources of the device as much as possible has become an important...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): G06F12/02
CPCG06F12/0253
Inventor 宋彦锋沈沉徐云松王西邓任红旭汤洋李英明杨芳陈献庆朱建斌张保善黄显果裘愉涛
Owner XUJI GRP
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com