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Novel wafer compressing mechanism

A compression mechanism and wafer technology, applied in the direction of electrical components, semiconductor/solid-state device manufacturing, circuits, etc., can solve the problems of no compression mechanism, high defect rate of wafer warping products, etc., to achieve product yield improvement, structure compact and reasonable effect

Inactive Publication Date: 2017-01-25
PIOTECH CO LTD
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0003] The purpose of the present invention is to solve the above problems, and mainly solve the problem that the existing semiconductor coating equipment does not have a pressing mechanism, and there is a high defective rate of products caused by wafer warping

Method used

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  • Novel wafer compressing mechanism

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Embodiment

[0012] refer to figure 1 , a novel wafer pressing mechanism, the mechanism includes a main body, the main body is connected with a motor 2 . The main body includes a pressing plate 1 , a heating plate 3 , a thimble 4 and a tray 5 . The upper and lower ends of the thimble 4 are respectively arranged in the inner holes of the heating plate 3 and the tray 5, and slide up and down in the inner holes. The upper end of the above-mentioned pressing plate 1 is in an inverted "L" shape.

[0013] When in use, the pressing plate 1 is driven by the linear motion of the motor, so that the pressing plate 1 tightly presses the wafer 6 to ensure the flatness of the wafer 6 . When the tray 5 lifts the ejector pin 4 to raise the wafer 6, the platen 1 will also rise simultaneously. The stroke of the pressing plate 1 is 5mm larger than that of the thimble to meet the requirements of use and ensure the stability of the cavity during the operation of the equipment.

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Abstract

The invention discloses a novel wafer compressing mechanism and mainly solves the problem of low product yield caused by wafer warping due to the fact that existing semiconductor coating equipment is not provided with a compressing mechanism. The novel wafer compressing mechanism comprises a main body which is connected with a motor, the main body comprises a compressing plate, a heating disc, an ejector pin and a tray, the upper end and the lower end of the ejector pin are arranged in inner holes of the heating disc and the tray respectively and slide up and down therein, and the upper end of the compressing plate is in the shape of an inverted L. When in use, the compressing plate is driven through linear motion of the motor to tightly press a wafer, so that flatness of the wafer is guaranteed. When the tray jacks up the ejector pin to lift the water, the compressing plate is lifted at the same time. Stroke of the compressing plate is greater than that of the ejector pin by 5mm to meet using needs, so that stability of a cavity when the equipment runs can be guaranteed. By adopting the novel wafer compressing mechanism, product yield can be increased; the mechanism can be widely popularized in the technical field of manufacturing and application of the semiconductor coating equipment.

Description

technical field [0001] The invention relates to a novel wafer pressing mechanism, which is realized by driving a pressing plate to exert pressure on warped wafers through linear motion of a motor. The invention belongs to the technical field of semiconductor coating equipment manufacturing and application. Background technique [0002] During the operation of the existing semiconductor coating equipment, it is often found that many wafers are warped. Because of its warping, the gas contact of the wafer is not uniform during the process, resulting in unstable transfer of the wafer, and the uniformity of the process result is not ideal. Contents of the invention [0003] The purpose of the present invention is to solve the above-mentioned problems, and mainly solve the problem that the existing semiconductor coating equipment has no pressing mechanism and has a high defective rate of products caused by wafer warping. [0004] To achieve the above object, the present invent...

Claims

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Application Information

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IPC IPC(8): H01L21/687
CPCH01L21/687
Inventor 续震刘忆军
Owner PIOTECH CO LTD
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