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Combining method of PCB inner-layer boards

A combination method and inner layer board technology, applied in multilayer circuit manufacturing, electrical components, printed circuit manufacturing, etc., can solve problems such as "layer deviation" and achieve the effect of strengthening fixation

Inactive Publication Date: 2017-01-25
BOARDTEK COMP SUZHOU
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] The purpose of the present invention is to provide a combination method of PCB inner boards to solve the problem of "layer deviation" caused by the pressing of PCB inner boards

Method used

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  • Combining method of PCB inner-layer boards

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Experimental program
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Effect test

Embodiment

[0027] Examples such as figure 1 , a method for assembling PCB inner layer boards, comprising the following steps.

[0028] S1) The lamination method stacks multi-layer inner substrates and films.

[0029] Described step S1) comprises the following steps:

[0030] S11) Fix a layer of inner substrate on the hot-melt table; this step is to preliminarily locate the bottom inner substrate, and use the bottom inner substrate as a reference to facilitate the positioning of subsequent superimposed films and other inner substrates.

[0031] Wherein, the inner substrate is provided with heat melting points and rivet points, wherein the rivet points are rivet holes.

[0032] S12) Overlaying the film or the inner substrate on the inner substrate in the step S11) by a superposition method. In this step, the number of superimposed layers is superimposed according to the requirements of the multi-layer board produced. Generally speaking, the inner substrate has 10 or more layers, or the ...

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PUM

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Abstract

The invention discloses a combining method of PCB inner-layer boards. The combining method comprises the following steps: (S1) laminating multiple layers of inner-layer substrates and rubber pieces by virtue of a laminating method; (S2) melting the inner-layer substrates and rubber pieces by virtue of a hot melt method, so as to form an inner-layer combined plate; and (S3) fixing the melted inner-layer combined plate by virtue of a rivet. According to the combining method, hot melt fixation is firstly carried out, and then rivet positioning is carried out, so that the problem of ''layer shift'' occurring during the lamination of existing PCB boards is solved; and a rivet positioning region and a hot melt region are not fixed in superposition and overlapping manners, so that the fixation among the inner-layer substrates or between the inner-layer substrates and the rubber pieces is further enhanced.

Description

technical field [0001] The invention relates to the fields of chemistry, machinery, electronics, etc., and specifically relates to a method for assembling a PCB inner layer board. Background technique [0002] The PCB board is the printed circuit board, also known as the printed circuit board, which is the substrate for the electrical connection of electronic components. According to the number of layers of circuit boards, it can be divided into single-panel, double-panel and other multi-layer circuit boards. [0003] The structure used for multilayer boards is usually: multiple double-sided wiring boards as the inner layer (inner layer board), two single-sided wiring boards as the outer layer (outer layer board) or multiple double-sided wiring boards as the inner layer (inner layer board) board), two printed circuit boards (outer layer boards) with one side as the outer layer, alternately through the positioning system and insulating bonding materials, and the conductive p...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/46
CPCH05K3/4644
Inventor 王杰
Owner BOARDTEK COMP SUZHOU