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A method for encapsulating LED lamp beads based on quantum dot fluorescent film

A technology of LED lamp beads and packaging method, applied in the direction of semiconductor devices, electrical components, circuits, etc., can solve the problems of difficulty in large-scale industrialization, low light conversion efficiency, complex process, etc., to reduce product defect rate and improve color. Threshold value, the effect of improving the concentration

Active Publication Date: 2018-10-26
SHENZHEN JUFEI OPTOELECTRONICS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] For this reason, the technical problem to be solved by the present invention is to overcome the technical bottleneck of the prior art which is complicated in technology, low in light conversion efficiency, high in cost, and difficult to realize large-scale industrialization, thereby proposing a kind of high color gamut value, avoiding the quantum dot Phosphor powder is affected by external moisture, oxygen and high temperature of the chip, and has a high yield rate and a packaging method for quantum dot fluorescent film type LED lamp beads that can be industrially produced in large quantities

Method used

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  • A method for encapsulating LED lamp beads based on quantum dot fluorescent film
  • A method for encapsulating LED lamp beads based on quantum dot fluorescent film
  • A method for encapsulating LED lamp beads based on quantum dot fluorescent film

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0036] 1) Take a certain amount of silicone-based packaging glue A, and drop it into the LED bracket on which the blue light chip (chip emission wavelength is 440nm) has been fixed, and control the dropping of packaging glue A to account for 50% of the internal volume of the bracket cup shell.

[0037] 2) Put the LED bracket dripped with the encapsulating glue A obtained in step 1) in an oven, and bake at 80° C. for 10 hours to cure the encapsulating glue A.

[0038] 3) Weigh 0.05g of BaS red light quantum dot phosphor powder with an emission wavelength of 630nm, and weigh 0.02g of Fe with an emission wavelength of 540nm 2 o 3 Green light quantum dot phosphors are placed in a container together.

[0039] 4) Weigh 0.45g of silica gel-based packaging glue B, pour it into the luminescent material weighed in step 3), and carry out vacuum defoaming and stirring to obtain quantum dot fluorescent glue B.

[0040] 5) Take a certain amount of quantum dot fluorescent glue B obtained i...

Embodiment 2

[0045]1) Take a certain amount of epoxy packaging glue A, and drop it into the LED bracket that has fixed the blue light chip (the chip emits light at a wavelength of 480nm), and control the dripping packaging glue A to account for 50% of the internal volume of the bracket cup shell.

[0046] 2) Put the LED bracket dripped with the encapsulating glue A obtained in step 1) in an oven, and bake at 180°C for 0.5h to cure the encapsulating glue A.

[0047] 3) Weigh 0.12g of ZnTe red light quantum dot phosphor powder with an emission wavelength of 660nm, and weigh 0.05g of Cd(S x Se 1-x ) green light quantum dot phosphors are placed in a container together.

[0048] 4) Weigh 0.60 g of polyurethane-based encapsulating glue B, pour it into the luminescent material weighed in step 3), and carry out vacuum defoaming and stirring to obtain quantum dot fluorescent glue B.

[0049] 5) Take a certain amount of the quantum dot fluorescent glue B obtained in step 4) and coat it on the corr...

Embodiment 3

[0054] 1) Take a certain amount of epoxy packaging glue A, drop it into the LED bracket that has been fixed with a UV chip (the chip emits light at a wavelength of 320nm), and control the dripping packaging glue A to account for 90% of the internal volume of the bracket cup shell .

[0055] 2) Put the LED bracket dripped with the encapsulating glue A obtained in step 1) in an oven, and bake at 120° C. for 12 hours to cure the encapsulating glue A.

[0056] 3) Weigh 0.17g of InAs red light quantum dot phosphor powder with emission wavelength of 640nm, 0.05g of InGaAs green light quantum dot phosphor powder with emission wavelength of 532nm, and 0.03g of CsPbCl with emission wavelength of 466nm 3 Blue light quantum dot phosphors are placed in a container together.

[0057] 4) Weigh 1.65g of epoxy-based packaging glue B, pour it into the luminescent material weighed in step 3), and carry out vacuum defoaming and stirring to obtain quantum dot fluorescent glue B.

[0058] 5) Tak...

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Abstract

Provided is a method for packaging an LED lamp bead (8) based on quantum-dot fluorescent film; The half-wave of the quantum dot material (6, 7) used is narrow, significantly improving the gamut value of the LED lamp bead such that the gamut value of the LED lamp bead reaches NTSC 96% or higher. In comparison with existing packaging methods, packaging with a quantum-dot fluorescent film prevents the quantum dot material from directly contacting a chip (3) and thus prevents the material from being subjected to the high temperature of the surface of the chip, improving the reliability of the lamp bead. Quantum-dot fluorescent film is used to obtain a white LED lamp bead, which can quantitatively control the content of the quantum dots and other light-emitting materials of each lamp bead, reducing the difficulty of packaging and the product defect rate and improving the degree of concentration of the color-producing region, making the invention suitable for large-scale industrial production.

Description

technical field [0001] The invention belongs to the field of LED backlight processing, and in particular relates to a method for packaging LED lamp beads based on quantum dot fluorescent films. Background technique [0002] Since the beginning of the 21st century, backlight technology has developed rapidly, and new technologies and products have been launched continuously. LED backlight has become the mainstream of the market. Compared with the traditional CCFL backlight, LED backlight has many advantages such as high color gamut, high brightness, long life, energy saving and environmental protection, real-time color controllable, etc., especially the high color gamut LED backlight makes TV, mobile phone, The screens of electronic products such as tablets have more vivid colors and a higher degree of color reproduction. At present, the commonly used LED backlight adopts the form of blue light chip to excite YAG yellow light phosphor. Due to the lack of red light component i...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L33/00H01L33/48H01L33/50H01L33/52
CPCH01L33/005H01L33/48H01L33/50H01L33/52
Inventor 邢其彬高丹鹏张志宽
Owner SHENZHEN JUFEI OPTOELECTRONICS CO LTD
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