Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

A packaging method for sandwich-type quantum dot LED lamp beads

A technology of LED lamp beads and packaging method, applied in electrical components, circuits, semiconductor devices, etc., can solve the problems of difficulty in large-scale industrialization, low light conversion efficiency, complex process, etc., to reduce difficulty and product defect rate, The effect of low phosphor concentration and high excitation efficiency

Active Publication Date: 2018-08-24
SHENZHEN JUFEI OPTOELECTRONICS CO LTD
View PDF4 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] For this reason, the technical problem to be solved by the present invention is to overcome the technical bottleneck of the prior art which is complicated in technology, low in light conversion efficiency, high in cost, and difficult to realize large-scale industrialization, thereby proposing a kind of high color gamut value, avoiding the quantum dot Encapsulation method of fluorescent powder affected by external moisture and oxygen, high yield rate, and mass-produced sandwich quantum dot LED lamp bead

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • A packaging method for sandwich-type quantum dot LED lamp beads
  • A packaging method for sandwich-type quantum dot LED lamp beads
  • A packaging method for sandwich-type quantum dot LED lamp beads

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0038] 1) Take a certain amount of epoxy packaging glue A, and drop it into the LED bracket that has fixed the blue light chip (the chip emits light at a wavelength of 420nm), and control the dropping of the packaging glue A to account for 60% of the internal volume of the bracket cup shell.

[0039] 2) Put the LED bracket dripped with the encapsulating glue A obtained in step 1) in an oven, and bake at 180°C for 0.5h to cure the encapsulating glue A.

[0040] 3) Weigh 0.55g of fluoride red phosphor powder with emission wavelength of 632nm, weigh 0.03g of NaCl and Fe with emission wavelength of 538nm 2 o 3 The green light quantum dot fluorescent powder is placed in a container together.

[0041] 4) Weigh 1.35g of silica gel-based packaging glue B, pour it into the luminescent material weighed in step 3), and carry out vacuum defoaming and stirring to obtain quantum dot fluorescent glue B.

[0042] 5) Take a certain amount of quantum dot fluorescent glue B obtained in step 4)...

Embodiment 2

[0047]1) Take a certain amount of epoxy packaging glue A, and drop it into the LED bracket that has fixed the blue light chip (the chip emits light at a wavelength of 480nm), and control the dropping of the packaging glue A to account for 10% of the internal volume of the bracket cup shell.

[0048] 2) Put the LED bracket dripped with the encapsulating glue A obtained in step 1) in an oven, and bake at 80° C. for 12 hours to cure the encapsulating glue A.

[0049] 3) Weigh 0.04g of PbTe red light quantum dot phosphor powder with an emission wavelength of 660nm, and weigh 0.02g of Cd(S x Se 1-x ) green light quantum dot phosphors are placed in a container together.

[0050] 4) Weigh 3.20 g of epoxy-based encapsulating glue B, pour it into the luminescent material weighed in step 3), and carry out vacuum defoaming and stirring to obtain quantum dot fluorescent glue B.

[0051] 5) Take a certain amount of quantum dot fluorescent glue B obtained in step 4) and drop it into the b...

Embodiment 3

[0056] 1) Take a certain amount of silica gel-based packaging glue A, and drop it into the LED bracket on which the ultraviolet light chip (chip emission wavelength is 360nm) has been fixed, and control the dripping packaging glue A to account for 35% of the internal volume of the bracket cup shell.

[0057] 2) Place the LED bracket dripped with the encapsulating glue A obtained in step 1) in an oven, and bake at 100° C. for 7 hours to cure the encapsulating glue A.

[0058] 3) Weigh 0.85g of silicate red phosphor with emission wavelength of 625nm, 0.34g of aluminate green phosphor with emission wavelength of 530nm, and 0.02g of Indium phosphor with emission wavelength of 473nm 2 o 3 Blue light quantum dot phosphors are placed in a container together.

[0059] 4) Weigh 2.33g of silica gel-based packaging glue B, pour it into the luminescent material weighed in step 3), and carry out vacuum defoaming and stirring to obtain quantum dot fluorescent glue B.

[0060] 5) Take a ce...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention belongs to the LED backlight processing field and particularly relates to a sandwich type quantum dot LED lamp bead packaging method. A half-wave width of a quantum dot material which is adopted by the sandwich type quantum dot LED lamp bead packaging method is relatively narrow, which can greatly improve a color gamut value of the LED lamp bead; the obtained color gamut value of the LED lamp bead can achieve more than NTSC 94%; the sandwich type quantum dot LED lamp bead packaging method uses a sandwich structure obtained through three times of glue dispensing to protect phosphor powder of the quantum dots, reduces erosion on the quantum dot material in the LED lamp bead by moisture and oxygen, prevents the quantum dot material from directly contacting a chip, prevents influence by high temperature on the surface of the chip, improves reliability of the lamp bead and adopts the quantum dot phosphor powder to obtain a white light LED lamp bead. Because the quantum dot phosphor powder has high excitation efficiency and the concentration of the phosphor powder in the packaging process is low, the sandwich type quantum dot LED lamp bead packaging method reduces difficulty of the packaging operation and a reject ratio, can be applied to mass batch industrial production and has a great market prospect and a high economic value.

Description

technical field [0001] The invention belongs to the field of LED backlight processing, and in particular relates to a packaging method for sandwich-type quantum dot LED lamp beads. Background technique [0002] Since the beginning of the 21st century, backlight technology has developed rapidly, and new technologies and products have been launched continuously. LED backlight has become the mainstream of the market. Compared with the traditional CCFL backlight, LED backlight has many advantages such as high color gamut, high brightness, long life, energy saving and environmental protection, real-time color controllable, etc., especially the high color gamut LED backlight makes TV, mobile phone, The screens of electronic products such as tablets have more vivid colors and a higher degree of color reproduction. At present, the commonly used LED backlight adopts the form of blue light chip to excite YAG yellow light phosphor. Due to the lack of red light component in the backlig...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Patents(China)
IPC IPC(8): H01L33/48H01L33/50H01L33/54
CPCH01L33/486H01L33/504H01L33/507H01L33/54H01L2933/0041H01L2933/005
Inventor 张志宽高丹鹏邢其彬项文斗王旭改
Owner SHENZHEN JUFEI OPTOELECTRONICS CO LTD
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com