Check patentability & draft patents in minutes with Patsnap Eureka AI!

Photovoltaic modules comprising organoclay

A technology of organoclay and bonding layer, applied in photovoltaic power generation, semiconductor devices, electrical components, etc., can solve the problems of frame power loss, high leakage current of insulating film, etc.

Inactive Publication Date: 2017-02-22
DOW GLOBAL TECH LLC
View PDF56 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Low resistivity leads to higher leakage current in the insulating film, which in turn leads to power loss in the bezel

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Photovoltaic modules comprising organoclay
  • Photovoltaic modules comprising organoclay
  • Photovoltaic modules comprising organoclay

Examples

Experimental program
Comparison scheme
Effect test

specific Embodiment

[0162] Material

[0163] CBC1 is a 50 / 50 ethylene-propylene (EP) / isotactic polypropylene (iPP) diblock copolymer in which 90 wt% of the ethylene-derived units are in the EP block and has an MFR of 7.5 (g / 10min; 230 °C / 2.16 kg).

[0164] CLOISITE clay 20A is bis(hydrogenated tallow alkyl) dimethyl salt and bentonite from Southern Clay Products, Inc.

[0165] MAHPECONC1(AMPLIFY tm TY1053H functional polymer) is maleic anhydride grafted (MAH-g) high density polyethylene (HDPE) with a density of 0.960 g / cm 3(ASTM D792), melt index of 2.0 g / 10 minutes (ASTM D1238), very high level of MAH grafting, available from The Dow Chemical Company.

[0166] MAHPPCONC1 is a maleic anhydride grafted (MAH-g) polypropylene (PP) having a melt index (MI) of 500 and a MAH content of 0.7% by weight, commercially available from The Dow Chemical Company.

[0167] CYANOX tm 1790 antioxidant is 1,3,5-tris(4-tert-butyl-3-hydroxy-2,6-dimethylbenzyl)-1,3,5-triazine-2,4,6-(1H ,3H,5H)-trione (CAS No. 0...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

PV modules with improved volume resistivity comprise an encapsulant film and a polyolefin backsheet at least one of which comprises organoclay.

Description

technical field [0001] The present invention relates to photovoltaic (PV) modules and / or cells. In one aspect, the present invention relates to polyolefin films for use in PV module construction, while in another aspect, the present invention relates to increasing the volume resistivity of polyolefin films used as backsheets or encapsulants for PV modules. Background technique [0002] Films used in PV modules need to have good volume resistivity for module performance. Module efficiency is related to the resistivity of the insulating layer. The low resistivity leads to higher leakage current of the insulating film, which in turn leads to power loss of the bezel. Films with improved volume resistivity are therefore of continuing interest to PV module manufacturers. Contents of the invention [0003] In one embodiment, the invention is a PV module comprising an organoclay. In one embodiment, the invention is a PV module comprising an encapsulant and a backsheet, wherein...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): H01L31/048H01L31/049
CPCH01L31/049H01L31/0481Y02E10/50H01L31/042
Inventor J·E·布恩坎普K·拉加迪亚H·张Y·胡
Owner DOW GLOBAL TECH LLC
Features
  • R&D
  • Intellectual Property
  • Life Sciences
  • Materials
  • Tech Scout
Why Patsnap Eureka
  • Unparalleled Data Quality
  • Higher Quality Content
  • 60% Fewer Hallucinations
Social media
Patsnap Eureka Blog
Learn More

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2025 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com