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Vertical crack formation method in brittle material substrate and segmentation method thereof

A technology for brittle material substrates and vertical cracks, applied in stone processing tools, stone processing equipment, electrical components, etc., can solve the problem of partial extension of vertical cracks

Active Publication Date: 2020-05-01
MITSUBOSHI DIAMOND IND CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

When a scribe line is formed, there are cases where the vertical crack fully expands in the thickness direction and divides the substrate, but there is also a case where the vertical crack only partially expands in the thickness direction

Method used

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  • Vertical crack formation method in brittle material substrate and segmentation method thereof
  • Vertical crack formation method in brittle material substrate and segmentation method thereof
  • Vertical crack formation method in brittle material substrate and segmentation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0077] In this example, it was confirmed that the load applied to the pressing body 100 affects the size of the indentation ID and the maximum length of the microcrack MC (hereinafter referred to as the maximum crack length).

[0078] Specifically, a glass substrate with a thickness of 0.2 mm was prepared as the brittle material substrate W, and as the pressing body 100, a diamond head with a conical tip 101 having an opening angle of 122° and a radius of curvature of 10 μm was used, and the applied The load to the pressing body 100 is divided into four levels of 1.3N, 2.5N, 3.8N, and 5.0N to form the indentation ID.

[0079] Figure 11 is a graph showing the relationship between the load and the diameter of the formed indentation ID, Figure 12 is a graph showing the relationship between load and the maximum crack length formed.

[0080] From Figure 11 and Figure 12 It was confirmed that the larger the load, the larger the size of the indentation ID and the larger the m...

Embodiment 2

[0082] In this example, the influence of the load applied to the pressing body 100 and the distance of the indentation ID (more specifically, its center position) from the groove line on the extension of the vertical crack VC was investigated. The conditions of the pressing body 100 and the brittle material substrate W are the same as those of the first embodiment.

[0083] Specifically, by dividing the load applied to the pressing body 100 into four levels of 1.3N, 2.5N, 3.8N, and 5.0N, and dividing the distance between the center position of the indentation and the groove line into 0 μm, ±10 μm, and ±20 μm , ±30 μm, and ±40 μm in 9 levels, all 36 conditions in which the combination of the load applied to the pressing body 100 and the distance from the center position of the indentation to the groove line are different from each other were determined. In addition, the case where the distance between the center position of the indentation and the groove line is negative means ...

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Abstract

Provided are a vertical crack formation method in a brittle material substrate and a division method thereof, capable of forming vertical cracks on a brittle material substrate without generating cullet. A method for forming vertical cracks in a brittle material substrate includes a groove line forming step of forming a groove line as a linear groove portion on one main surface; and an indentation forming step of partially pressing the vicinity of the groove line with a predetermined pressing body. , forming an indentation; in the groove line forming process, the groove line is formed in a manner to maintain a crack-free state directly below the groove line, and the vertical crack is formed from the groove line to the The brittle material substrate extends in the thickness direction.

Description

technical field [0001] The present invention relates to a method for dividing a brittle material substrate, and in particular, to a method for forming a vertical crack when dividing a brittle material substrate. Background technique [0002] The manufacturing process of a flat panel display panel, a solar cell panel, etc. generally includes a process of dividing a substrate (mother substrate) made of a brittle material such as a glass substrate, a ceramic substrate, or a semiconductor substrate. For this division, a method of forming a scribe line on the surface of the substrate with a scribing tool such as a diamond stone or a cutting wheel, and extending cracks (vertical cracks) from the scribe line in the thickness direction of the substrate is widely used. When scribe lines are formed, there are cases where the vertical cracks fully extend in the thickness direction and divide the substrate, but there are also cases where the vertical cracks only partially extend in the ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B28D1/22B28D1/32
CPCB28D1/222B28D1/225B28D1/327H01L21/76205H01L21/76232H01L21/76816H01L21/78
Inventor 岩坪佑磨曾山浩
Owner MITSUBOSHI DIAMOND IND CO LTD
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