Aluminum alloy for consumer electronic product shell and preparing method and application of aluminum alloy

Abstract

The invention discloses an aluminum alloy for a consumer electronic product shell and a preparing method and application of the aluminum alloy. The aluminum alloy for the consumer electronic product shell comprises, by mass percent, 0.38%-0.48% of Si, 0.55%-0.70% of Mg, smaller than or equal to 0.12% of Fe, smaller than or equal to 0.03% of Mn, smaller than or equal to 0.03% of Cr, 0.10%-0.30% of Cu, smaller than or equal to 0.03% of Zn, smaller than or equal to 0.10% of Ti, smaller than 0.15% of other impuritiesand the balance Al, wherein Mn+Cr<=0.05%, and Si<=Mg / 1.732+0.08%. The alloy has high hardness and good mechanical performance after being subjected to T6 treatment, an extrusion base material metallographic structure is a single perfect recrystallization fine grain structure, good anodic oxidation resisting performance is achieved, and the aluminum alloy is suitable for being used for manufacturing the consumer electronic product shell.

Description

technical field [0001] The invention belongs to the field of aluminum alloy materials and the manufacture thereof, and in particular relates to an aluminum alloy for consumer electronics shells, a preparation method and application thereof. Background technique [0002] With the widespread use of smart phones and tablet computers, consumers have higher and higher requirements for appearance / texture in addition to functional requirements for high-end consumer electronics. Aluminum alloy metal structural parts have become one of the standard configurations of consumer electronics housings. [0003] Currently on the market, there are various methods for the housing of consumer electronics, such as die-casting, direct stamping of plates and strips, and CNC processing of extruded substrates. Among them, the die-casting molding products have a large amount of mechanical processing, and the die-casting waste is easy to oxidize and contains a lot of impurities. The molding process ...

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Problems solved by technology

When Si and Mg are at the lower limit, the mechanical properties are low, specifically tensile strength (MPa) ≥ 210Mpa; yield strength (MPa) ≥ 180Mpa; elongation (%) ≥ 10%; Vickers hardness (HV) ≥ 65; When Si and Mg are high, the mechanical properties are higher, specifically: tensile strength (MPa) ≥ 270Mpa; yield strength (MPa) ≥ 230Mpa; elongation (%) ≥ 80%; Vickers hardness (HV) ≥ 90, However, after the customer's CNC processing, the surface lines of the anodized treatment are high and obvious, which cannot meet the customer's needs

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